Lenovo ThinkServer TS200 server

Lenovo ThinkServer TS200 server

0 GB Tower (5U) Intel® Xeon® 3000 Sequence X3450 2.66 GHz 4 GB 400 W

Model TS200Part no. SPH11IT_4X 45J6196EAN 884942691867

106 specifications
  • ProcessorIntel® Xeon® 3000 Sequence
  • Memory4 GB
  • Storage0 GB
  • Weight25.2 kg
  • Processor manufacturerIntel
  • Networking featuresDual Gigabit Ethernet
See all specifications

Overview

Processor
Intel® Xeon® 3000 Sequence
Memory
4 GB
Storage
0 GB
Weight
25.2 kg
Processor manufacturer
Intel
Networking features
Dual Gigabit Ethernet
Brand
Lenovo
Category
Server
Model
TS200
Part numbers
SPH11IT_4X 45J6196, SPH11IT_4X 45J6197, SPH11IT_4X 67Y1380, SPH15IT_4X 45J6201, SPH15IT_4X 45J6202, SPH15IT_4X 45J6204 +17 more
EAN / UPC
884942691867, 884942692444, 884942818011, 884942692307 +7 more
Also known as
Lenovo ThinkServer TS200 server 0 GB Tower (5U) Intel® Xeon® 3000 Sequence X3450 2.66 GHz 4 GB 400 W

Specifications

106 specifications in 13 groups

Processor

SpecificationValue
Processor manufacturerIntel
Processor familyIntel® Xeon® 3000 Sequence
Processor modelX3450
Processor frequency2.66 GHz
Processor boost frequency3.2 GHz
Processor cores4
Processor cache8 MB
Memory channels supported by processorDual
Number of processors installed1
Thermal Design Power (TDP)95 W
Processor cache typeSmart Cache
System bus rate2.5 GT/s
Bus typeDMI
CPU multiplier (bus/core ratio)20
ECC supported by processorYes
Embedded options availableYes
Execute Disable BitYes
FSB ParityNo
Idle StatesYes
Maximum internal memory supported by processor32 GB
Maximum number of PCI Express lanes16
Maximum number of SMP processors1
Memory bandwidth supported by processor (max)21 GB/s
Memory clock speeds supported by processor800,1066,1333 MHz
Memory types supported by processorDDR3-SDRAM
Number of Processing Die Transistors774 M
PCI Express configurations1x16, 2x8, 4x4
Physical Address Extension (PAE)36 bit
Physical Address Extension (PAE)Yes
Processing Die size296 mm²
Processor codeSLBLD
Processor codenameLynnfield
Processor lithography45 nm
Processor operating modes64-bit
Processor package size37.5 x 37.5 mm
Processor seriesIntel Xeon 3400 Series
Processor socketLGA 1156 (Socket H)
Processor threads8
SteppingB1
Supported instruction setsSSE4.2
Tcase72.7 °C
Thermal Monitoring TechnologiesNo
Conflict-Free processorNo

Memory

SpecificationValue
Internal memory4 GB
Buffered memory typeRegistered (buffered)
ECCYes
Memory clock speed1066 MHz
Memory layout (slots x size)1 x 4 GB
Memory slots6x DIMM

Storage

SpecificationValue
Total storage capacity0 GB
HDD size3.5"
Number of HDDs supported4
RAID levels1
Hot-swapYes
Optical drive typeDVD-RW

Network

SpecificationValue
Networking featuresDual Gigabit Ethernet

Ports & interfaces

SpecificationValue
Ethernet LAN (RJ-45) ports2
USB 2.0 ports quantity7
PS/2 ports quantity0
Serial ports quantity1
VGA (D-Sub) ports quantity1

Expansion slots

SpecificationValue
PCI Express x4 slots2
PCI Express x8 slots2
PCI Express slots version2.0
PCI slots2

Design

SpecificationValue
Chassis typeTower (5U)

Software

SpecificationValue
Compatible operating systemsWindows Server 2008 Standard R2 Windows Server 2008 Enterprise R2 Windows Server 2008 SBS Standard Windows Server 2008 EBS Standard Windows Foundations R2 Novell SUSE Linux Enterprise Server (SLES) 11 Red Hat Enterprise Linux 5.3 VMware ESX Server 4.0 & 4.0i

Processor special features

SpecificationValue
CPU configuration (max)1
Enhanced Intel SpeedStep TechnologyYes
Intel 64Yes
Intel Clear Video TechnologyNo
Intel Demand Based SwitchingYes
Intel Dual Display Capable TechnologyNo
Intel Enhanced Halt StateYes
Intel FDI TechnologyNo
Intel Fast Memory AccessNo
Intel Flex Memory AccessNo
Intel Rapid Storage TechnologyNo
Intel Trusted Execution TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Intel® Anti-Theft Technology (Intel® AT)No
Intel® Clear Video HD Technology (Intel® CVT HD)No
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)No
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® InTru™ 3D TechnologyNo
Intel® Insider™No
Intel® My WiFi Technology (Intel® MWT)No
Intel® Quick Sync Video TechnologyNo
Intel® Smart CacheYes
Intel® Turbo Boost Technology1.0
Intel® Wireless Display (Intel® WiDi)No
Processor ARK ID42929

Power

SpecificationValue
Redundant power supply (RPS) supportNo
Power supply400 W

Operational conditions

SpecificationValue
Operating temperature (T-T)10 - 35 °C
Storage temperature (T-T)10 - 43 °C
Operating relative humidity (H-H)10 - 80%
Storage relative humidity (H-H)10 - 90%

Weight & dimensions

SpecificationValue
Width216 mm
Depth540 mm
Height438 mm
Weight25.2 kg

Other features

SpecificationValue
RAID controller typeLSI MR10il

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