Lenovo System x3250 M5
Model System x3250 M5Part no. 5458F3GEAN 5051045197236
127 specifications
- ProcessorIntel® Xeon® E3 V3 Family
- Memory8 GB
- OSNo
- Processor manufacturerIntel
- Maximum storage capacity6.4 TB
- Cabling technology10/100/1000Base-T(X)
Overview
- Processor
- Intel® Xeon® E3 V3 Family
- Memory
- 8 GB
- OS
- No
- Processor manufacturer
- Intel
- Maximum storage capacity
- 6.4 TB
- Cabling technology
- 10/100/1000Base-T(X)
- Brand
- Lenovo
- Category
- Server
- Model
- System x3250 M5
- Part number
- 5458F3G
- EAN / UPC
- 5051045197236
- Also known as
- Lenovo System x3250 M5 server Rack (1U) Intel® Xeon® E3 V3 Family E3-1241V3 3.5 GHz 8 GB 300 W
Specifications
127 specifications in 15 groups
Processor
| Specification | Value |
|---|---|
| Processor manufacturer | Intel |
| Processor family | Intel® Xeon® E3 V3 Family |
| Processor model | E3-1241V3 |
| Processor frequency | 3.5 GHz |
| Processor boost frequency | 3.9 GHz |
| Processor cores | 4 |
| Processor cache | 8 MB |
| Memory channels supported by processor | Dual |
| Number of processors installed | 1 |
| Thermal Design Power (TDP) | 80 W |
| Processor cache type | Smart Cache |
| System bus rate | 5 GT/s |
| Bus type | DMI2 |
| ECC supported by processor | Yes |
| Embedded options available | No |
| Execute Disable Bit | Yes |
| FSB Parity | No |
| Graphics & IMC lithography | 22 nm |
| Idle States | Yes |
| Maximum internal memory supported by processor | 32 GB |
| Maximum number of PCI Express lanes | 16 |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory clock speeds supported by processor | 1333,1600 MHz |
| Memory types supported by processor | DDR3-SDRAM |
| Number of QPI links | 0 |
| PCI Express configurations | 1x8, 2x8, 1x8+2x4 |
| Processor codename | Haswell |
| Processor lithography | 22 nm |
| Processor operating modes | 32-bit, 64-bit |
| Processor package size | 37.5 x 37.5 mm |
| Processor series | Intel Xeon E3-1200 v3 |
| Processor socket | LGA 1150 (Socket H3) |
| Processor threads | 8 |
| Scalability | 1S |
| Stepping | C0 |
| Supported instruction sets | AVX 2.0, SSE4.1, SSE4.2 |
| Thermal Monitoring Technologies | Yes |
| Thermal solution specification | PCG 2013D |
| Conflict-Free processor | No |
| Intelligent Platform Management Interface (IPMI) support | Yes |
Memory
| Specification | Value |
|---|---|
| Internal memory | 8 GB |
| Memory clock speed | 1600 MHz |
| Memory layout (slots x size) | 1 x 8 GB |
| Memory slots | 4 |
| Maximum internal memory | 32 GB |
Storage
| Specification | Value |
|---|---|
| Maximum storage capacity | 6.4 TB |
| HDD interface | Serial ATA, Serial Attached SCSI (SAS) |
| HDD size | 2.5" |
| Number of HDDs supported | 8 |
| SSD interface | Serial Attached SCSI (SAS) |
| RAID support | Yes |
| RAID levels | 0, 1 |
| Hot-swap | Yes |
Graphics
| Specification | Value |
|---|---|
| On-board graphics card | No |
| On-board graphics card model | Not available |
| Maximum on-board graphics card memory | 1.74 GB |
| Number of displays supported (on-board graphics) | 3 |
| Number of execution units | 20 |
| On-board graphics card DirectX version | 11.2 |
| On-board graphics card base frequency | 350 MHz |
| On-board graphics card dynamic frequency (max) | 1200 MHz |
| Maximum graphics card memory | 16 MB |
Network
| Specification | Value |
|---|---|
| Cabling technology | 10/100/1000Base-T(X) |
| Ethernet LAN | Yes |
| Ethernet interface type | Gigabit Ethernet |
Ports & interfaces
| Specification | Value |
|---|---|
| Ethernet LAN (RJ-45) ports | 4 |
| USB 2.0 ports quantity | 4 |
| USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 2 |
| Serial ports quantity | 1 |
| VGA (D-Sub) ports quantity | 1 |
Expansion slots
| Specification | Value |
|---|---|
| PCI Express x4 (Gen 3.x) slots | 1 |
| PCI Express slots version | 3.0 |
Design
| Specification | Value |
|---|---|
| Chassis type | Rack (1U) |
Performance
| Specification | Value |
|---|---|
| Trusted Platform Module (TPM) | Yes |
Software
| Specification | Value |
|---|---|
| Operating system installed | No |
| Compatible operating systems | Microsoft Windows Server 2012 R2, 2012, and 2008 R2, RHEL 5 and 6, SLES 11 & 12, VMware vSphere 5.5 (ESXi) and VMware vSphere 5.1 (ESXi) |
Processor special features
| Specification | Value |
|---|---|
| CPU configuration (max) | 1 |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel 64 | Yes |
| Intel Clear Video Technology | No |
| Intel Demand Based Switching | No |
| Intel Dual Display Capable Technology | No |
| Intel Enhanced Halt State | Yes |
| Intel FDI Technology | No |
| Intel Fast Memory Access | Yes |
| Intel Flex Memory Access | Yes |
| Intel I/O Acceleration Technology | Yes |
| Intel Identity Protection Technology version | 1.00 |
| Intel Rapid Storage Technology | No |
| Intel Secure Key Technology version | 1.00 |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel Stable Image Platform Program (SIPP) version | 1.00 |
| Intel TSX-NI | Yes |
| Intel TSX-NI version | 1.00 |
| Intel Trusted Execution Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel® Anti-Theft Technology (Intel® AT) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | No |
| Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® InTru™ 3D Technology | No |
| Intel® Insider™ | No |
| Intel® My WiFi Technology (Intel® MWT) | No |
| Intel® OS Guard | Yes |
| Intel® Quick Sync Video Technology | No |
| Intel® Secure Key | Yes |
| Intel® Smart Cache | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Wireless Display (Intel® WiDi) | No |
| Processor ARK ID | 80909 |
Power
| Specification | Value |
|---|---|
| Redundant power supply (RPS) support | Yes |
| Power supply | 300 W |
| Number of main power supplies | 1 |
Operational conditions
| Specification | Value |
|---|---|
| Operating temperature (T-T) | 10 - 35 °C |
| Storage temperature (T-T) | 10 - 43 °C |
| Operating relative humidity (H-H) | 8 - 80% |
| Storage relative humidity (H-H) | 8 - 80% |
| Operating altitude | 0 - 2134 m |
Weight & dimensions
| Specification | Value |
|---|---|
| Width | 435 mm |
| Depth | 576 mm |
| Height | 43 mm |
Other features
| Specification | Value |
|---|---|
| Graphics card | G200eR2 |
| Graphics card family | Matrox |
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