Lenovo 3250 M5

Lenovo 3250 M5

Model 3250 M5Part no. 5458I4CEAN 5051045160469

120 specifications
  • ProcessorIntel® Xeon® E3 V3 Family
  • Memory4 GB
  • OSNo
  • Processor manufacturerIntel
  • Maximum storage capacity24 TB
  • Cabling technology10/100/1000Base-T(X)
See all specifications

Overview

Processor
Intel® Xeon® E3 V3 Family
Memory
4 GB
OS
No
Processor manufacturer
Intel
Maximum storage capacity
24 TB
Cabling technology
10/100/1000Base-T(X)
Brand
Lenovo
Category
Server
Model
3250 M5
Part numbers
5458I4C, 5458E1G, 5458B2G, 5458F2G, 5458A3U, 5458G3U +1 more
EAN / UPC
5051045160469, 4053162427549, 5051045175715, 4053162396210 +7 more
Also known as
Lenovo System 3250 M5 server Rack (1U) Intel® Xeon® E3 V3 Family E3-1220V3 3.1 GHz 4 GB 300 W

Specifications

120 specifications in 15 groups

Processor

SpecificationValue
Processor manufacturerIntel
Processor familyIntel® Xeon® E3 V3 Family
Processor modelE3-1220V3
Processor frequency3.1 GHz
Processor boost frequency3.5 GHz
Processor cores4
Processor cache8 MB
Memory channels supported by processorDual
Number of processors installed1
Thermal Design Power (TDP)80 W
Processor cache typeSmart Cache
System bus rate5 GT/s
Bus typeDMI
Compatible processor seriesIntel® Xeon®
ECC supported by processorYes
Embedded options availableNo
Execute Disable BitYes
FSB ParityNo
Graphics & IMC lithography22 nm
Idle StatesYes
Maximum internal memory supported by processor32 GB
Maximum number of PCI Express lanes16
Memory bandwidth supported by processor (max)25.6 GB/s
Memory clock speeds supported by processor1333,1600 MHz
Memory types supported by processorDDR3-SDRAM
Number of QPI links1
PCI Express configurations1x8, 1x16, 2x4, 2x8
Processor codenameHaswell
Processor lithography22 nm
Processor operating modes64-bit
Processor package size37.5 x 37.5 mm
Processor seriesIntel Xeon E3-1200 v3
Processor socketLGA 1150 (Socket H3)
Processor threads4
Scalability1S
SteppingC0
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Monitoring TechnologiesYes
Thermal solution specificationPCG 2013D
Conflict-Free processorNo
Intelligent Platform Management Interface (IPMI) supportYes

Memory

SpecificationValue
Internal memory4 GB
Memory clock speed1600 MHz
Memory layout (slots x size)1 x 4 GB
Memory slots4
Maximum internal memory32 GB

Storage

SpecificationValue
Maximum storage capacity24 TB
Number of HDDs supported4
Supported HDD sizes3.5"
SSD interfaceSerial Attached SCSI (SAS)
RAID supportYes
RAID levels0, 1
Hot-swapYes

Graphics

SpecificationValue
On-board graphics cardNo
On-board graphics card modelNot available
Maximum graphics card memory16 MB

Network

SpecificationValue
Cabling technology10/100/1000Base-T(X)
Ethernet LANYes
Ethernet interface typeGigabit Ethernet

Ports & interfaces

SpecificationValue
Ethernet LAN (RJ-45) ports2
USB 2.0 ports quantity4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
Serial ports quantity1
VGA (D-Sub) ports quantity1

Expansion slots

SpecificationValue
PCI Express x4 (Gen 3.x) slots1
PCI Express slots version3.0

Design

SpecificationValue
Chassis typeRack (1U)

Performance

SpecificationValue
Trusted Platform Module (TPM)Yes

Software

SpecificationValue
Operating system installedNo
Compatible operating systemsMicrosoft Windows Server 2012 R2, 2012, and 2008 R2, RHEL 5 and 6, SLES 11 & 12, VMware vSphere 5.5 (ESXi) and VMware vSphere 5.1 (ESXi)

Processor special features

SpecificationValue
CPU configuration (max)1
Enhanced Intel SpeedStep TechnologyYes
Intel 64Yes
Intel Clear Video TechnologyNo
Intel Demand Based SwitchingNo
Intel Dual Display Capable TechnologyNo
Intel Enhanced Halt StateYes
Intel FDI TechnologyNo
Intel Fast Memory AccessYes
Intel Flex Memory AccessYes
Intel Identity Protection Technology version1.00
Intel Rapid Storage TechnologyNo
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP)Yes
Intel Stable Image Platform Program (SIPP) version1.00
Intel TSX-NIYes
Intel TSX-NI version1.00
Intel Trusted Execution TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel® Anti-Theft Technology (Intel® AT)Yes
Intel® Clear Video HD Technology (Intel® CVT HD)No
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)No
Intel® Hyper Threading Technology (Intel® HT Technology)No
Intel® Identity Protection Technology (Intel® IPT)Yes
Intel® InTru™ 3D TechnologyNo
Intel® Insider™No
Intel® My WiFi Technology (Intel® MWT)No
Intel® OS GuardYes
Intel® Quick Sync Video TechnologyNo
Intel® Secure KeyYes
Intel® Turbo Boost Technology2.0
Intel® Wireless Display (Intel® WiDi)No
Processor ARK ID75052

Power

SpecificationValue
Redundant power supply (RPS) supportYes
Power supply300 W
Number of main power supplies1

Operational conditions

SpecificationValue
Operating temperature (T-T)10 - 35 °C
Storage temperature (T-T)10 - 43 °C
Operating relative humidity (H-H)8 - 80%
Storage relative humidity (H-H)8 - 80%
Operating altitude0 - 2134 m

Weight & dimensions

SpecificationValue
Width435 mm
Depth576 mm
Height43 mm

Other features

SpecificationValue
Graphics cardG200eR2
Graphics card familyMatrox
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x

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