Product comparison · 2 server barebones

GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel vs GIGABYTE R163-ZG2-AAJ2 Rev. 3.x

53specifications compared
29differ
24identical
4known for one product only

Key differences

The GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 7 more processors supported than the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x (8 vs 1). The GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 40 more DIMM slots than the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x (64 vs 24). The GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 14 more storage drives supported than the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x (28 vs 14). Motherboard chipset: Intel C741 on the GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, AMD SoC on the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x. Processor socket: LGA 4677 (Socket E) on the GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, Socket SP5 on the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x.

Motherboard chipset
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
- R163-ZG2-AAJ2 Rev. 3.x:AMD SoC
Processor socket
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
- R163-ZG2-AAJ2 Rev. 3.x:Socket SP5
Number of processors supported
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:8
- R163-ZG2-AAJ2 Rev. 3.x:1
Compatible processor series
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel® Xeon®
- R163-ZG2-AAJ2 Rev. 3.x:AMD EPYC 9005, AMD EPYC 9004
Number of DIMM slots
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:64
- R163-ZG2-AAJ2 Rev. 3.x:24
Memory channels
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
- R163-ZG2-AAJ2 Rev. 3.x:Dodeca-channel
Number of storage drives supported
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:28
- R163-ZG2-AAJ2 Rev. 3.x:14
Number of 2.5" bays
- H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:24
- R163-ZG2-AAJ2 Rev. 3.x:12

Side by side

Differences highlightedShow differences only

Comparison of H263-S62-LAW1, R163-ZG2-AAJ2 Rev. 3.x
57 specifications	A GIGABYTE H263-S62-LAW1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel Model H263-S62-LAW1 View product	B GIGABYTE R163-ZG2-AAJ2 Rev. 3.x View product
Processor4 differ
Motherboard chipsetDiffers	Intel C741	AMD SoC
Processor socketDiffers	LGA 4677 (Socket E)	Socket SP5
Number of processors supportedDiffers	8	1
Compatible processor seriesDiffers	Intel® Xeon®	AMD EPYC 9005, AMD EPYC 9004
Memory2 differ
Number of DIMM slotsDiffers	64	24
Memory channelsDiffers	Octa-channel	Dodeca-channel
Storage3 differ
Number of storage drives supportedDiffers	28	14
Number of 2.5" baysDiffers	24	12
Supported storage drive interfacesDiffers	PCI Express 4.0, Serial ATA, Serial Attached SCSI (SAS)	Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4
RAID levelsKnown for one	0, 1, 5, 10	Unknown — not stated by the source
Ports & interfaces1 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers	8	3
VGA (D-Sub) ports quantityKnown for one	4	Unknown — not stated by the source
Mini DisplayPorts quantityKnown for one	Unknown — not stated by the source	1
Expansion slots2 differ
PCI Express x16 (Gen 5.x) slotsDiffers	4	3
Number of M.2 (M) slotsDiffers	4	2
Design4 differ
Chassis typeDiffers	Rack (2U)	Rack (1U)
LED indicatorsDiffers	Status	LAN, HDD, SSD, Status
Fan diameterDiffers	8 cm	4 cm
Number of fansDiffers	4 fan(s)	8 fan(s)
Heat sink includedKnown for one	Unknown — not stated by the source	Yes
Power3 differ
Power supplyDiffers	3000 W	2000 W
Number of redundant power supplies supportedDiffers	3	2
Input currentDiffers	16 A	10 - 12 A
Operational conditions1 differ
Operating temperature (T-T)Differs	10 - 40 °C	10 - 35 °C
Weight & dimensions4 differ
DepthDiffers	850 mm	815 mm
HeightDiffers	87.5 mm	43.5 mm
WeightDiffers	36.5 kg	13.5 kg
WidthDiffers	440 mm	438 mm
Packaging data5 differ
Packaging contentDiffers	1 x H263-S62-LAW1; 24 x Carriers; 1 x 3-Section Rail kit	1 x R163-ZG2-AAJ2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x GPU power cable (12VHPWR, 400mm); 1 x 2-Section Rail kit
Package widthDiffers	1190 mm	1043 mm
Package depthDiffers	711 mm	594 mm
Package heightDiffers	423 mm	252 mm
Package weightDiffers	41.5 kg	15.7 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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