Product comparison · 2 server barebones

GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel vs GIGABYTE R163-ZG2-AAJ2 Rev. 3.x

54specifications compared
25differ
29identical
7known for one product only

Key differences

The GIGABYTE R163-ZG2-AAJ2 Rev. 3.x has 8 more DIMM slots than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (24 vs 16). The GIGABYTE R163-ZG2-AAJ2 Rev. 3.x has 11 more storage drives supported than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (14 vs 3). The GIGABYTE R163-ZG2-AAJ2 Rev. 3.x has 10 more 2.5" bays than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (12 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, AMD SoC on the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, Socket SP5 on the GIGABYTE R163-ZG2-AAJ2 Rev. 3.x.

Motherboard chipset
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
- R163-ZG2-AAJ2 Rev. 3.x:AMD SoC
Processor socket
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
- R163-ZG2-AAJ2 Rev. 3.x:Socket SP5
Compatible processor series
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel® Xeon®
- R163-ZG2-AAJ2 Rev. 3.x:AMD EPYC 9005, AMD EPYC 9004
Number of DIMM slots
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
- R163-ZG2-AAJ2 Rev. 3.x:24
Memory channels
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
- R163-ZG2-AAJ2 Rev. 3.x:Dodeca-channel
Number of storage drives supported
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:3
- R163-ZG2-AAJ2 Rev. 3.x:14
Number of 2.5" bays
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2
- R163-ZG2-AAJ2 Rev. 3.x:12
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
- E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:4
- R163-ZG2-AAJ2 Rev. 3.x:3

Side by side

Differences highlightedShow differences only

Comparison of E263-S30-AAD1, R163-ZG2-AAJ2 Rev. 3.x
61 specifications	A GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel Model E263-S30-AAD1 View product	B GIGABYTE R163-ZG2-AAJ2 Rev. 3.x View product
Processor3 differ
Motherboard chipsetDiffers	Intel C741	AMD SoC
Processor socketDiffers	LGA 4677 (Socket E)	Socket SP5
Compatible processor seriesDiffers	Intel® Xeon®	AMD EPYC 9005, AMD EPYC 9004
Memory2 differ
Number of DIMM slotsDiffers	16	24
Memory channelsDiffers	Octa-channel	Dodeca-channel
Storage3 differ
Number of storage drives supportedDiffers	3	14
Number of 2.5" baysDiffers	2	12
Supported storage drive interfacesDiffers	Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)	Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4
RAID levelsKnown for one	0, 1	Unknown — not stated by the source
Networkidentical
Ethernet LANKnown for one	Yes	Unknown — not stated by the source
Ethernet interface typeKnown for one	Gigabit Ethernet	Unknown — not stated by the source
Ethernet LAN data ratesKnown for one	10,100,1000 Mbit/s	Unknown — not stated by the source
LAN controllerKnown for one	Intel® I210-AT	Unknown — not stated by the source
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers	4	3
Ethernet LAN (RJ-45) portsDiffers	1	0
Expansion slots2 differ
PCI Express x16 (Gen 5.x) slotsDiffers	2	3
Number of M.2 (M) slotsDiffers	1	2
Featuresidentical
Backplanes supportKnown for one	Unknown — not stated by the source	Yes
Design3 differ
Chassis typeDiffers	Rack (2U)	Rack (1U)
Fan diameterDiffers	8 cm	4 cm
Number of fansDiffers	4 fan(s)	8 fan(s)
Power2 differ
Power supplyDiffers	1600 W	2000 W
DC output current (+12 V)Known for one	133 A	Unknown — not stated by the source
80 PLUS certificationDiffers	80 PLUS Platinum	80 PLUS Titanium
Weight & dimensions3 differ
DepthDiffers	520 mm	815 mm
HeightDiffers	87.5 mm	43.5 mm
WeightDiffers	16 kg	13.5 kg
Packaging data5 differ
Packaging contentDiffers	1 x E263-S30-AAD1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers	1 x R163-ZG2-AAJ2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x GPU power cable (12VHPWR, 400mm); 1 x 2-Section Rail kit
Package widthDiffers	732 mm	1043 mm
Package depthDiffers	588 mm	594 mm
Package heightDiffers	285 mm	252 mm
Package weightDiffers	18.8 kg	15.7 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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