Product comparison · 2 server barebones

GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel vs GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

Add a product
  • 58specifications compared
  • 22differ
  • 36identical
  • 3known for one product only

Key differences

The GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 4 more DIMM slots than the GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel (16 vs 12). The GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel (5 vs 3). The GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel (4 vs 2). Motherboard chipset: AMD SoC on the GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel, Intel C741 on the GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel.

  • Motherboard chipset
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:AMD SoC
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
  • Processor socket
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:Socket SP6
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
  • Number of DIMM slots
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:12
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
  • Memory channels
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:Hexa-channel
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
  • Number of storage drives supported
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:3
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:2
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:2.5,M.2
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2.5,M.2,3.5
  • Chassis type
    • E243-E30-AAD1 AMD SoC Socket SP6 Rack (2U) Black, Steel:Rack (2U)
    • R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Rack (1U)

Side by side

Differences highlightedShow differences only (on)
Comparison of E243-E30-AAD1, R163-S30-AAG2
61 specifications
Processor3 differ
Motherboard chipsetDiffersAMD SoCIntel C741
Processor socketDiffersSocket SP6LGA 4677 (Socket E)
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers1216
Memory channelsDiffersHexa-channelOcta-channel
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
RAID levelsKnown for oneUnknown — not stated by the source0, 1, 5, 10
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design3 differ
Chassis typeDiffersRack (2U)Rack (1U)
Fan diameterDiffers8 cm4 cm
Number of fansDiffers4 fan(s)6 fan(s)
Power3 differ
Power supplyDiffers1600 W800 W
Input currentDiffers10 - 12 A5 - 10 A
80 PLUS certificationDiffers80 PLUS Platinum80 PLUS Titanium
DC output current (+12 V)Known for one133 AUnknown — not stated by the source
Weight & dimensions3 differ
DepthDiffers520 mm710 mm
HeightDiffers87.5 mm43.5 mm
WeightDiffers13.5 kg11.4 kg
Packaging data4 differ
Packaging contentDiffers1 x E243-E30-AAD1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x GPU power cable (16-pin, 360mm); 1 x GPU power cable (16-pin, 490mm)1 x R163-S30-AAG2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers; 1 x 2-Section Rail kit
Package widthDiffers737 mm982 mm
Package heightDiffers299 mm250 mm
Package weightDiffers15.6 kg20.6 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

More server barebone comparisons

All server barebone comparisons