Product comparison · 2 server barebones

GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel vs GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel

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  • 58specifications compared
  • 19differ
  • 39identical
  • 3known for one product only

Key differences

The GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 4 more DIMM slots than the GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, AMD SoC on the GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, Socket SP6 on the GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
  • Processor socket
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
  • Number of DIMM slots
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • Memory channels
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
  • Number of storage drives supported
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:3
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2.5,M.2
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2.5,M.2,3.5
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:3
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:4

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Differences highlightedShow differences only (on)
Comparison of E163-S30-AAG1, R143-E30-AAB1
61 specifications
Processor3 differ
Motherboard chipsetDiffersIntel C741AMD SoC
Processor socketDiffersLGA 4677 (Socket E)Socket SP6
Compatible processor seriesDiffersIntel® Xeon®AMD EPYC 8004, AMD EPYC 8005 Series
Memory2 differ
Number of DIMM slotsDiffers1612
Memory channelsDiffersOcta-channelHexa-channel
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4
RAID levelsKnown for one0, 1Unknown — not stated by the source
Ports & interfaces1 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design1 differ
Number of fansDiffers5 fan(s)6 fan(s)
Power2 differ
Input currentDiffers5 - 10 A4 - 10 A
DC output current (+12 V)Known for oneUnknown — not stated by the source66 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers12.1 kg21.2 kg
Packaging data4 differ
Packaging contentDiffers1 x E163-S30-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R143-E30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightDiffers15 kg23.3 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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