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Product comparison · 2 server barebones

GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel vs GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel

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  • 53specifications compared
  • 26differ
  • 27identical
  • 16known for one product only

Key differences

The GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 12 more DIMM slots than the GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel (16 vs 4). The GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, Intel C252 on the GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, LGA 1200 (Socket H5) on the GIGABYTE R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel.

  • Motherboard chipset
    • Intel C741
    • Intel C252
  • Processor socket
    • LGA 4677 (Socket E)
    • LGA 1200 (Socket H5)
  • Compatible processor series
    • Intel® Xeon®
    • Intel Xeon E
  • Number of DIMM slots
    • 16
    • 4
  • Supported memory types
    • DDR5-SDRAM
    • DDR4-SDRAM
  • Memory channels
    • Octa-channel
    • Dual-channel
  • Number of storage drives supported
    • 3
    • 5
  • Number of 2.5" bays
    • 2
    • 4

Side by side

Differences highlightedShow differences only
69 specifications
A

GIGABYTE

E163-S30-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

Model E163-S30-AAG1

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B

GIGABYTE

R112-X30 Intel C252 LGA 1200 (Socket H5) Rack (1U) Black, Steel

Model R112-X30

View product
Processor3 differ
Motherboard chipsetDiffersIntel C741Intel C252
Processor socketDiffersLGA 4677 (Socket E)LGA 1200 (Socket H5)
Compatible processor seriesDiffersIntel® Xeon®Intel Xeon E
Intel Xeon seriesKnown for oneE-2300
Memory3 differ
Number of DIMM slotsDiffers164
Supported memory typesDiffersDDR5-SDRAMDDR4-SDRAM
Memory channelsDiffersOcta-channelDual-channel
ECCKnown for oneYes
Non-ECCKnown for oneYes
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, PCI Express 3.0
RAID levelsDiffers0, 10, 1, 5, 10
Graphics1 differ
On-board graphics card modelDiffersAspeed AST2600Aspeed AST2500
Ports & interfaces3 differ
USB 2.0 ports quantityDiffers04
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers32
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantityKnown for one2
Ethernet LAN (RJ-45) portsDiffers12
VGA (D-Sub) ports quantityKnown for one1
COM ports quantityKnown for one1
Mini DisplayPorts quantityKnown for one1
Expansion slotsidentical
PCI Express x16 (Gen 4.x) slotsKnown for one1
PCI Express x16 (Gen 5.x) slotsKnown for one2
Featuresidentical
Compatible operating systemsKnown for oneRed Hat Enterprise Linux 6.9; Red Hat Enterprise Linux 7.3; SUSE Linux Enterprise Server 11.2; SUSE Linux Enterprise Server 12.2; Ubuntu 16.04.6 LTS; Ubuntu 18.04.2 LTS; VMware 6.5; Windows Server 2016; Windows Server 2019
Design1 differ
Number of fansDiffers5 fan(s)2 fan(s)
Power4 differ
Power supplyDiffers800 W350 W
Number of main power suppliesDiffers21
Input currentDiffers5 - 10 A3 - 6 A
DC output current (+5 V)Known for one14 A
DC output current (+12 V)Known for one29 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Bronze
Number of redundant power supplies supportedKnown for one2
Number of redundant power supplies installedKnown for one2
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions2 differ
DepthDiffers520 mm393.2 mm
WidthDiffers438 mm430 mm
WeightKnown for one12.1 kg
Packaging data4 differ
Packaging contentDiffers1 x E163-S30-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R112-X30; 1 x CPU heatsink
Package widthDiffers787 mm592 mm
Package depthDiffers594 mm518 mm
Package heightDiffers226 mm155 mm
Package weightKnown for one15 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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