Product comparison · 2 server barebones

GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

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  • 56specifications compared
  • 24differ
  • 32identical
  • 4known for one product only

Key differences

The GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 1 more processors supported than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (2 vs 1). The GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 20 more DIMM slots than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (32 vs 12). The GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 9 more storage drives supported than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (12 vs 3). Motherboard chipset: AMD SoC on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
  • Processor socket
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
  • Number of processors supported
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:1
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2
  • Number of DIMM slots
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:32
  • Memory channels
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
  • Number of storage drives supported
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:3
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:12
  • Number of 2.5" bays
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:12
  • Storage drive sizes supported
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2.5,M.2
    • R183-S92-AAV1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2.5"

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Differences highlightedShow differences only (on)
Comparison of E143-E30-AAB1, R183-S92-AAV1
60 specifications
Processor4 differ
Motherboard chipsetDiffersAMD SoCIntel C741
Processor socketDiffersSocket SP6LGA 4677 (Socket E)
Number of processors supportedDiffers12
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers1232
Memory channelsDiffersHexa-channelOcta-channel
Storage5 differ
Number of storage drives supportedDiffers312
Number of 2.5" baysDiffers212
Storage drive sizes supportedDiffers2.5,M.22.5"
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, Serial Attached SCSI (SAS)
SSD form factorDiffersM.22.5"
Network1 differ
LAN controllerDiffersIntel® I210-ATIntel® I350-AM2
Ports & interfaces1 differ
Ethernet LAN (RJ-45) portsDiffers12
Expansion slotsidentical
Number of M.2 (M) slotsKnown for one1Unknown — not stated by the source
Design1 differ
Number of fansDiffers5 fan(s)8 fan(s)
Power3 differ
Power supplyDiffers800 W1600 W
Input currentDiffers4 - 10 A10 - 12 A
DC output current (+12 V)Known for one66 AUnknown — not stated by the source
80 PLUS certificationDiffers80 PLUS Platinum80 PLUS Titanium
Weight & dimensions2 differ
DepthDiffers520 mm815 mm
WeightDiffers12.4 kg25.6 kg
Packaging data5 differ
Packaging contentDiffers1 x E143-E30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R183-S92-AAV1; 2 x CPU heatsinks; 1 x Mini-DP to D-Sub cable; 6 x Carriers; 1 x 2-Section Rail kit
Package widthDiffers787 mm1052 mm
Package depthDiffers594 mm602 mm
Package heightDiffers226 mm267 mm
Package weightDiffers14.8 kg27.6 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Backplanes supportKnown for oneUnknown — not stated by the sourceYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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