Product comparison · 2 server barebones

GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel vs GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel

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  • 57specifications compared
  • 21differ
  • 36identical
  • 7known for one product only

Key differences

The GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 8 more DIMM slots than the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel (12 vs 4). The GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: Intel C262 on the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel, AMD SoC on the GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel. Processor socket: LGA 1700 on the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel, Socket SP6 on the GIGABYTE R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
  • Processor socket
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
  • Number of DIMM slots
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • Memory channels
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
  • Number of storage drives supported
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:3
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:2
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:2.5,M.2
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2.5,M.2,3.5
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:3
    • R143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:4

Side by side

Differences highlightedShow differences only (on)
Comparison of E133-X10-AAG1, R143-E30-AAB1
64 specifications
Processor3 differ
Motherboard chipsetDiffersIntel C262AMD SoC
Processor socketDiffersLGA 1700Socket SP6
Compatible processor seriesDiffersIntel Xeon E, Intel Xeon 6300AMD EPYC 8004, AMD EPYC 8005 Series
Intel Xeon seriesKnown for oneE-2400, 6300Unknown — not stated by the source
Memory2 differ
Number of DIMM slotsDiffers412
Memory channelsDiffersDual-channelHexa-channel
ECCKnown for oneYesUnknown — not stated by the source
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATASerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4
RAID levelsKnown for one0, 1Unknown — not stated by the source
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers21
Expansion slots1 differ
PCI Express x4 slotsKnown for one1Unknown — not stated by the source
PCI Express x16 (Gen 5.x) slotsDiffers12
Design1 differ
Number of fansDiffers4 fan(s)6 fan(s)
Power2 differ
Input currentDiffers5 - 10 A4 - 10 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
DC output current (+12 V)Known for oneUnknown — not stated by the source66 A
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers12.1 kg21.2 kg
Packaging data4 differ
Packaging contentDiffers1 x E133-X10-AAG1;1 x CPU heatsink;1 x Mini-DP to D-Sub cable1 x R143-E30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightDiffers14 kg23.3 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Backplanes supportKnown for oneUnknown — not stated by the sourceYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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