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Product comparison · 2 server barebones

GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel vs GIGABYTE R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

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  • 57specifications compared
  • 21differ
  • 36identical
  • 6known for one product only

Key differences

  • Motherboard chipset
    • AMD B650E
    • Intel C741
  • Processor socket
    • Socket AM5
    • LGA 4677 (Socket E)
  • Number of DIMM slots
    • 4
    • 16
  • Memory channels
    • Dual-channel
    • Octa-channel
  • Number of storage drives supported
    • 3
    • 5
  • Number of 2.5" bays
    • 2
    • 4
  • Storage drive sizes supported
    • 2.5,M.2
    • 2.5,M.2,3.5
  • RAID levels
    • 0, 1
    • 0, 1, 5, 10

Side by side

Differences highlightedShow differences only
63 specifications
A

GIGABYTE

E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel

Model E133-C10-AAG1

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B

GIGABYTE

R163-S30-AAG2 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

Model R163-S30-AAG2

View product
Processor3 differ
Motherboard chipsetDiffersAMD B650EIntel C741
Processor socketDiffersSocket AM5LGA 4677 (Socket E)
Compatible processor seriesDiffersAMD Ryzen 9000 Series, AMD EPYC™ 4005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers416
Memory channelsDiffersDual-channelOcta-channel
ECCKnown for oneYes
Non-ECCKnown for oneYes
Storage5 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATASerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
RAID levelsDiffers0, 10, 1, 5, 10
Network1 differ
LAN controllerDiffersBroadcom BCM5720Intel® I210-AT
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers21
Expansion slots1 differ
PCI Express x4 slotsKnown for one1
PCI Express x16 (Gen 5.x) slotsDiffers12
Design1 differ
Number of fansDiffers3 fan(s)6 fan(s)
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 30 °C10 - 35 °C
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers12.4 kg11.4 kg
Packaging data3 differ
Packaging contentDiffers1 x E133-C10-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R163-S30-AAG2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers; 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightKnown for one20.6 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneYes
Backplanes supportKnown for oneYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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