Product comparison · 2 cpus

HP E5630 SL170 G6 FIO Kit vs HP X5672 processor

Key differences

Processor model
- E5630 SL170 G6 FIO Kit:E5630
- X5672 processor:X5672
Processor base frequency
- E5630 SL170 G6 FIO Kit:2.53 GHz
- X5672 processor:3.2 GHz
System bus rate
- E5630 SL170 G6 FIO Kit:5.86 GT/s
- X5672 processor:6.4 GT/s
Processor boost frequency
- E5630 SL170 G6 FIO Kit:2.8 GHz
- X5672 processor:0 GHz
Thermal Design Power (TDP)
- E5630 SL170 G6 FIO Kit:80 W
- X5672 processor:95 W
CPU multiplier (bus/core ratio)
- E5630 SL170 G6 FIO Kit:19
- X5672 processor:24
Memory bandwidth supported by processor (max)
- E5630 SL170 G6 FIO Kit:25.6 GB/s
- X5672 processor:32 GB/s
Memory clock speeds supported by processor
- E5630 SL170 G6 FIO Kit:800,1066 MHz
- X5672 processor:800,1066,1333 MHz

Differences highlightedShow differences only

Comparison of E5630 SL170 G6 FIO Kit, X5672
27 specifications	A HP E5630 SL170 G6 FIO Kit View product	B HP X5672 processor Model X5672 View product
Processor7 differ
Processor modelDiffers	E5630	X5672
Processor base frequencyDiffers	2.53 GHz	3.2 GHz
System bus rateDiffers	5.86 GT/s	6.4 GT/s
Processor boost frequencyDiffers	2.8 GHz	0 GHz
Thermal Design Power (TDP)Differs	80 W	95 W
CPU multiplier (bus/core ratio)Differs	19	24
Memory bandwidth supported by processor (max)Differs	25.6 GB/s	32 GB/s
Memory1 differ
Memory clock speeds supported by processorDiffers	800,1066 MHz	800,1066,1333 MHz
ECCKnown for one	Yes	Unknown — not stated by the source
Operational conditionsidentical
Maximum operating temperatureKnown for one	Unknown — not stated by the source	82.9 °C
Weight & dimensionsidentical
WidthKnown for one	Unknown — not stated by the source	45 mm
HeightKnown for one	Unknown — not stated by the source	42.5 mm
Other featuresidentical
Temperature (max)Known for one	77.6 °C	Unknown — not stated by the source

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.