ASUS Z11PA-D8 LGA 3647 (Socket P) SSI CEB
ASUS

Z11PA-D8 LGA 3647 (Socket P) SSI CEB

Model Z11PA-D8Part no. 90SB06H0-M0UAY0EAN 889349756386

48 specifications
  • Weight1.24 kg
  • Processor manufacturerIntel
  • Supported memory typesDDR4-SDRAM
  • Supported storage drive interfacesSATA III
  • On-board graphics card memory64 MB
  • USB 2.0 connectors1
See all specifications

Overview

Weight
1.24 kg
Processor manufacturer
Intel
Supported memory types
DDR4-SDRAM
Supported storage drive interfaces
SATA III
On-board graphics card memory
64 MB
USB 2.0 connectors
1
Brand
ASUS
Category
Motherboard
Model
Z11PA-D8
Part numbers
90SB06H0-M0UAY0, 0SB06H0-M0UAY0
EAN / UPC
889349756386, 4712900756388
Also known as
ASUS Z11PA-D8 LGA 3647 (Socket P) SSI CEB

Specifications

48 specifications in 14 groups

Processor

SpecificationValue
Processor manufacturerIntel
Processor socketLGA 3647 (Socket P)

Memory

SpecificationValue
Supported memory typesDDR4-SDRAM
Number of memory slots8
Memory voltage1.2 V
Supported memory clock speeds2133,2400,2666 MHz
Maximum internal memory1 TB
Maximum RDIMM memory256 GB

Storage controllers

SpecificationValue
Supported storage drive interfacesSATA III
RAID supportYes
RAID levels0, 1, 5, 10

Graphics

SpecificationValue
On-board graphics card memory64 MB
On-board graphics card modelAspeed AST2500

Internal I/O

SpecificationValue
USB 2.0 connectors1
USB 3.2 Gen 1 (3.1 Gen 1) connectors1
Number of SATA III connectors16
CPU fan connectorYes
Chassis intrusion connectorYes
Serial port headers1
TPM connectorYes

Rear panel I/O ports

SpecificationValue
USB 2.0 ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity4
Ethernet LAN (RJ-45) ports4
PS/2 ports quantity0
VGA (D-Sub) ports quantity1

Network

SpecificationValue
Ethernet LANYes
Ethernet interface typeGigabit Ethernet
LAN controllerIntel® I210-AT
Wi-FiNo

Features

SpecificationValue
Motherboard form factorSSI CEB

Expansion slots

SpecificationValue
PCI Express x8 slots1
PCI Express x8 (Gen 2.x) slots0
PCI Express x16 slots2
PCI Express x16 (Gen 2.x) slots0
PCI Express x16 (Gen 3.x) slots0

Operational conditions

SpecificationValue
Storage temperature (T-T)-40 - 70 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)20 - 90%

Packaging data

SpecificationValue
Package weight2.32 kg

Logistics data

SpecificationValue
Harmonized System (HS) code84733020

Weight & dimensions

SpecificationValue
Width305 mm
Depth267 mm

Other features

SpecificationValue
Supported LRDIMM module capacity32GB, 64GB
Maximum LRDIMM memory512 GB
Supported RDIMM module capacity4GB, 8GB, 16GB, 32GB
Weight1.24 kg
Number of DIMM slots8
Number of processors supported2

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