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Flex IT HP EliteBook 840 G3 (Refurbished)
Flex IT

HP EliteBook 840 G3 (Refurbished)

Model HP EliteBook 840 G3 (Refurbished)Part no. L3C66AV-NL-SB63-R4EAN 8719325226935

157 specifications Checked today
  • Display35.6 cm (14")
  • Resolution1366 x 768 pixels
  • ProcessorIntel® Core™ i7
  • Memory8 GB
  • Storage256 GB
  • GraphicsNot available
See all specifications

Overview

Display
35.6 cm (14")
Resolution
1366 x 768 pixels
Processor
Intel® Core™ i7
Memory
8 GB
Storage
256 GB
Graphics
Not available
Brand
Flex IT
Category
Laptop
Model
HP EliteBook 840 G3 (Refurbished)
Part numbers
L3C66AV-NL-SB63-R4, L3C66AV-ES-SB13-R4, L3C66AV-NL-SB148-R4, L3C66AV-NL-SB205-R4, L3C66AV-NL-SB206-R4, L3C66AV-NL-SB216-R4 +34 more
EAN / UPC
8719325226935, 8719325226980
Also known as
HP EliteBook 840 G3 (Refurbished) Intel® Core™ i7 i7-6600U Laptop 35.6 cm (14") HD 8 GB DDR4-SDRAM 256 GB SSD Windows 10 Pro Multi

Specifications

157 specifications in 22 groups

Design

Product typeLaptop
Country of originChina
Original brand nameHP

Display

Display diagonal35.6 cm (14")
Display resolution1366 x 768 pixels
TouchscreenNo
HD typeHD

Processor

Processor manufacturerIntel
Processor familyIntel® Core™ i7
Processor generation6th gen Intel® Core™ i7
Processor modeli7-6600U
Processor cores2
Processor threads4
Processor boost frequency3.4 GHz
Processor frequency2.6 GHz
Processor cache4 MB
Processor cache typeSmart Cache
Processor socketLGA 1356 (Socket B2)
Processor lithography14 nm
Processor operating modes64-bit
Processor seriesIntel Core i7-6600 Mobile Series
Processor codenameSkylake
Bus typeOPI
SteppingD1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.8 GHz
Configurable TDP-up25 W
Configurable TDP-down7.5 W
Configurable TDP-down frequency0.8 GHz
Tjunction100 °C
Maximum number of PCI Express lanes12
PCI Express configurations1x4, 4x1
PCI Express slots version3.0

Memory

Internal memory8 GB
Internal memory typeDDR4-SDRAM
Memory clock speed2133 MHz
Memory slots2x SO-DIMM

Storage

Total storage capacity256 GB
Storage mediaSSD
SSD capacity256 GB
Optical drive typeNo
Card reader integratedYes
Compatible memory cardsSDHC, SDXC, SD

Graphics

On-board graphics cardYes
Discrete graphics cardNo
Discrete graphics card modelNot available
On-board GPU manufacturerIntel
On-board graphics card modelIntel® HD Graphics 520
Maximum on-board graphics card memory32 GB
On-board graphics card base frequency300 MHz
On-board graphics card dynamic frequency (max)1050 MHz
On-board graphics card DirectX version12.0
On-board graphics card OpenGL version4.4
On-board graphics card ID1916

Audio

Audio systemBang & Olufsen
Speakers manufacturerBang & Olufsen
Built-in microphoneYes
Number of microphones2

Camera

Front cameraYes

Network

Mobile network connectionYes
Wi-FiYes
BluetoothYes
WWANNot installed
SIM card supportYes

Ports & interfaces

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity1
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity1
Ethernet LAN (RJ-45) ports1
DisplayPorts quantity1
VGA (D-Sub) ports quantity1
Combo headphone/mic portYes
Docking connectorYes
I/O ports1 USB 3.0, 1 USB 3.0 charging, 1 USB Type-CTM, 1 DisplayPort, 1 VGA, 1 headphone/microphone combo, 1 AC power, 1 RJ-45, 1 docking connector

Performance

Rated lifetime4 year(s)

Keyboard

Pointing deviceTouchpad + Pointing Stick
Keyboard languageMulti

Software

Operating system installedWindows 10 Pro
Bundled softwareHP Noise Reduction Software, HP Clear Sound Amp

Processor special features

Intel® Wireless Display (Intel® WiDi)Yes
CPU configuration (max)1
Embedded options availableYes
Enhanced Intel SpeedStep TechnologyYes
Execute Disable BitYes
Graphics & IMC lithography14 nm
Idle StatesYes
Intel 64Yes
Intel Clear Video TechnologyYes
Intel Enhanced Halt StateYes
Intel Flex Memory AccessYes
Intel Identity Protection Technology version1.00
Intel Secure Key Technology version1.00
Intel Small Business Advantage (SBA) version1.00
Intel Smart Connect TechnologyYes
Intel Smart Response Technology version1.00
Intel Software Guard Extensions (Intel SGX)Yes
Intel Stable Image Platform Program (SIPP)Yes
Intel Stable Image Platform Program (SIPP) version1.00
Intel TSX-NIYes
Intel TSX-NI version1.00
Intel Trusted Execution TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel® Clear Video HD Technology (Intel® CVT HD)Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)Yes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® Identity Protection Technology (Intel® IPT)Yes
Intel® InTru™ 3D TechnologyYes
Intel® Insider™Yes
Intel® My WiFi Technology (Intel® MWT)Yes
Intel® OS GuardYes
Intel® Quick Sync Video TechnologyYes
Intel® Secure KeyYes
Intel® Small Business Advantage (Intel® SBA)Yes
Intel® Smart Response TechnologyYes
Intel® Turbo Boost Technology2.0
Processor ARK ID88192
Processor codeSR2F1
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Thermal Monitoring TechnologiesYes
Conflict-Free processorYes

Battery

Battery technologyLithium-Ion (Li-Ion)
Number of battery cells3
Battery capacity46 Wh

Power

AC adapter power45 W
DC-in jackYes

Security

Fingerprint readerYes

Certificates

Low halogenYes

Sustainability

Sustainability certificatesENERGY STAR

Weight & dimensions

Weight1.54 kg
Width338 mm
Depth237 mm
Height18.9 mm

Carbon footprint

Total carbon footprint (kg of CO2e)294.0000000000000000000

Other features

Climate change total (kg CO2 eq.) 3 years New220.5 kg
Climate change total (kg CO2 eq.) 3 years Refurb137.704237695499 kg
Climate change total (kg CO2 eq.) Difference absolute 3 years New - Refurb-82.7957623045013 kg
Climate change total (kg CO2 eq.) Difference percentage 3 years New - Refurb-37.5490985507942%
Climate change total (kg CO2 eq.) Full life New294 kg
Particulate matter (disease incidence) 3 years New0.0000221605728000517
Particulate matter (disease incidence) 3 years Refurb0.000011419392021346
Particulate matter (disease incidence) Difference absolute 3 years New - Refurb-0.0000107411807787057
Particulate matter (disease incidence) Difference percentage 3 years New - Refurb-0.48%
Particulate matter (disease incidence) Full life New0.000029547430400069
Resource use (fossils) (MJ) 3 years New3021.61328846002 MJ
Resource use (fossils) (MJ) 3 years Refurb2073.87802352112 MJ
Resource use (fossils) (MJ) Difference absolute 3 years New - Refurb-947.735264938901 MJ
Resource use (fossils) (MJ) Difference percentage 3 years New - Refurb-0.31%
Resource use (fossils) (MJ) Full life New4028.81771794669 MJ
Resource use minerals and metals (kg Sb eq.) 3 years New0.0508511523021022 kg
Resource use minerals and metals (kg Sb eq.) 3 years Refurb0.0237948884771439 kg
Resource use minerals and metals (kg Sb eq.) Difference absolute 3 years New - Refurb-0.0270562638249583 kg
Resource use minerals and metals (kg Sb eq.) Difference percentage 3 years New - Refurb-0.53%
Resource use minerals and metals (kg Sb eq.) Full life New0.0678015364028029 kg
Expansion slots1 media card reader, 1 external SIM
UNSPSC-code43211503

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