Product comparison · 2 server barebones

GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel vs GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel

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  • 57specifications compared
  • 22differ
  • 35identical
  • 3known for one product only

Key differences

The GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 4 more DIMM slots than the GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 10 more storage drives supported than the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (13 vs 3). The GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 10 more 2.5" bays than the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (12 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, AMD SoC on the GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, Socket SP6 on the GIGABYTE R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
  • Processor socket
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
  • Number of DIMM slots
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • Memory channels
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
  • Number of storage drives supported
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:3
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:13
  • Number of 2.5" bays
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:4
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:3
  • Chassis type
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Rack (2U)
    • R143-E32-AAC1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Rack (1U)

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Differences highlightedShow differences only (on)
Comparison of E263-S30-AAV1, R143-E32-AAC1
60 specifications
Processor3 differ
Motherboard chipsetDiffersIntel C741AMD SoC
Processor socketDiffersLGA 4677 (Socket E)Socket SP6
Compatible processor seriesDiffersIntel® Xeon®AMD EPYC 8004, AMD EPYC 8005 Series
Memory2 differ
Number of DIMM slotsDiffers1612
Memory channelsDiffersOcta-channelHexa-channel
Storage3 differ
Number of storage drives supportedDiffers313
Number of 2.5" baysDiffers212
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4
Ports & interfaces1 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers43
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design3 differ
Chassis typeDiffersRack (2U)Rack (1U)
Fan diameterDiffers8 cm4 cm
Number of fansDiffers4 fan(s)6 fan(s)
Power3 differ
Power supplyDiffers1600 W1300 W
Input currentDiffers10 - 12 A7 - 12 A
DC output current (+12 V)Known for oneUnknown — not stated by the source80.5 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Weight & dimensions3 differ
DepthDiffers520 mm710 mm
HeightDiffers87.5 mm43.5 mm
WeightDiffers18 kg21.2 kg
Packaging data4 differ
Packaging contentDiffers1 x E263-S30-AAV1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R143-E32-AAC1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers732 mm982 mm
Package depthDiffers588 mm594 mm
Package heightDiffers285 mm250 mm
Package weightKnown for oneUnknown — not stated by the source23.3 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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