Product comparison · 2 server barebones

GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel vs GIGABYTE H262-Z6B Rev. A00

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  • 55specifications compared
  • 27differ
  • 28identical
  • 5known for one product only

Key differences

The GIGABYTE H262-Z6B Rev. A00 has 7 more processors supported than the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (8 vs 1). The GIGABYTE H262-Z6B Rev. A00 has 48 more DIMM slots than the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (64 vs 16). The GIGABYTE H262-Z6B Rev. A00 has 9 more storage drives supported than the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (12 vs 3). Motherboard chipset: Intel C741 on the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, AMD SoC on the GIGABYTE H262-Z6B Rev. A00. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, Socket SP3 on the GIGABYTE H262-Z6B Rev. A00.

  • Motherboard chipset
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
    • H262-Z6B Rev. A00:AMD SoC
  • Processor socket
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
    • H262-Z6B Rev. A00:Socket SP3
  • Number of processors supported
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:1
    • H262-Z6B Rev. A00:8
  • Compatible processor series
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel® Xeon®
    • H262-Z6B Rev. A00:AMD EPYC 7002, AMD EPYC 7003
  • Number of DIMM slots
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
    • H262-Z6B Rev. A00:64
  • Supported memory types
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:DDR5-SDRAM
    • H262-Z6B Rev. A00:DDR4-SDRAM
  • Number of storage drives supported
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:3
    • H262-Z6B Rev. A00:12
  • Number of 2.5" bays
    • E263-S30-AAV1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2
    • H262-Z6B Rev. A00:8

Side by side

Differences highlightedShow differences only (on)
Comparison of E263-S30-AAV1, H262-Z6B Rev. A00
60 specifications
Processor4 differ
Motherboard chipsetDiffersIntel C741AMD SoC
Processor socketDiffersLGA 4677 (Socket E)Socket SP3
Number of processors supportedDiffers18
Compatible processor seriesDiffersIntel® Xeon®AMD EPYC 7002, AMD EPYC 7003
Memory2 differ
Number of DIMM slotsDiffers1664
Supported memory typesDiffersDDR5-SDRAMDDR4-SDRAM
Storage3 differ
Number of storage drives supportedDiffers312
Number of 2.5" baysDiffers28
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, Serial Attached SCSI (SAS), PCI Express 4.0
Graphics1 differ
On-board graphics card modelDiffersAspeed AST2600Aspeed AST2500
Network1 differ
LAN controllerDiffersIntel® I210-ATIntel® I350-AM2
Ports & interfaces3 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers48
Ethernet LAN (RJ-45) portsDiffers18
Mini DisplayPorts quantityDiffers14
Expansion slots1 differ
PCI Express x16 (Gen 4.x) slotsKnown for oneUnknown — not stated by the source8
Number of M.2 (M) slotsDiffers14
PCI Express x16 (Gen 5.x) slotsKnown for one2Unknown — not stated by the source
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Compatible operating systemsKnown for oneUnknown — not stated by the sourceCitrix Hypervisor 8.2.0 or later; Red Hat Enterprise Linux 8.3 or later; Red Hat Enterprise Linux 9.0 or later; SUSE Linux Enterprise Server 12 SP5 or later; SUSE Linux Enterprise Server 15 SP2 or later; Ubuntu 18.04.5 LTS or later; Ubuntu 20.04 LTS or later; Ubuntu 22.04 LTS or later; VMware ESXi 6
Design2 differ
LED indicatorsDiffersLAN, HDD, SSD, StatusStatus
Number of fansDiffers4 fan(s)8 fan(s)
Power3 differ
Power supplyDiffers1600 W2200 W
Input currentDiffers10 - 12 A12.6 - 14 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions2 differ
DepthDiffers520 mm840 mm
WidthDiffers438 mm440 mm
WeightKnown for one18 kgUnknown — not stated by the source
Packaging data4 differ
Packaging contentDiffers1 x E263-S30-AAV1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x H262-Z6B; 8 x CPU heatsinks; 1 x 3-Section Rail kit
Package widthDiffers732 mm1180 mm
Package depthDiffers588 mm779 mm
Package heightDiffers285 mm300 mm

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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