Product comparison · 2 server barebones

GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel vs GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel

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  • 60specifications compared
  • 24differ
  • 36identical
  • 3known for one product only

Key differences

The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 12 more DIMM slots than the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel (16 vs 4). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (5 vs 3). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (4 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, Intel C262 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel, LGA 1700 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
  • Processor socket
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
  • Number of DIMM slots
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Memory channels
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
  • Number of storage drives supported
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:3
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2.5,M.2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:2.5,M.2,3.5
  • RAID levels
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:0, 1
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:0, 1, 10, 5

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Differences highlightedShow differences only (on)
Comparison of E263-S30-AAD1, R133-X10-AAA2
63 specifications
Processor2 differ
Motherboard chipsetDiffersIntel C741Intel C262
Processor socketDiffersLGA 4677 (Socket E)LGA 1700
Intel Xeon seriesKnown for oneUnknown — not stated by the sourceE-2400
Memory2 differ
Number of DIMM slotsDiffers164
Memory channelsDiffersOcta-channelDual-channel
Storage5 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, PCI Express 4.0
RAID levelsDiffers0, 10, 1, 10, 5
Ports & interfaces1 differ
Ethernet LAN (RJ-45) portsDiffers12
Expansion slotsidentical
PCI Express x4 slotsKnown for oneUnknown — not stated by the source1
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design2 differ
Chassis typeDiffersRack (2U)Rack (1U)
Fan diameterDiffers8 cm4 cm
Power3 differ
Power supplyDiffers1600 W550 W
Input currentDiffers10 - 12 A4 - 8 A
DC output current (+12 V)Differs133 A44 A
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions3 differ
DepthDiffers520 mm710 mm
HeightDiffers87.5 mm43.5 mm
WeightDiffers16 kg17.5 kg
Packaging data5 differ
Packaging contentDiffers1 x E263-S30-AAD1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R133-X10-AAA2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers732 mm982 mm
Package depthDiffers588 mm594 mm
Package heightDiffers285 mm250 mm
Package weightDiffers18.8 kg19.5 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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