Product comparison · 2 server barebones

GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel vs GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel

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  • 55specifications compared
  • 20differ
  • 35identical
  • 5known for one product only

Key differences

The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 4 more DIMM slots than the GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel has 10 more storage drives supported than the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (13 vs 3). The GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel has 10 more 2.5" bays than the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (12 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, AMD SoC on the GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, Socket SP6 on the GIGABYTE R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
  • Processor socket
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
  • Number of DIMM slots
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • Memory channels
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
  • Number of storage drives supported
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:3
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:13
  • Number of 2.5" bays
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
  • Ethernet LAN (RJ-45) ports
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:1
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:0
  • PCI Express x16 (Gen 5.x) slots
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2
    • R143-EG2-AAC2 AMD SoC Socket SP6 Rack (1U) Black, Steel:3

Side by side

Differences highlightedShow differences only (on)
Comparison of E163-S30-AAB1, R143-EG2-AAC2
60 specifications
Processor3 differ
Motherboard chipsetDiffersIntel C741AMD SoC
Processor socketDiffersLGA 4677 (Socket E)Socket SP6
Compatible processor seriesDiffersIntel® Xeon®AMD EPYC 8004, AMD EPYC 8005 Series
Memory2 differ
Number of DIMM slotsDiffers1612
Memory channelsDiffersOcta-channelHexa-channel
Storage2 differ
Number of storage drives supportedDiffers313
Number of 2.5" baysDiffers212
Networkidentical
Ethernet LANKnown for oneYesUnknown — not stated by the source
Ethernet interface typeKnown for oneGigabit EthernetUnknown — not stated by the source
Ethernet LAN data ratesKnown for one10,100,1000 Mbit/sUnknown — not stated by the source
LAN controllerKnown for oneIntel® I210-ATUnknown — not stated by the source
Ports & interfaces1 differ
Ethernet LAN (RJ-45) portsDiffers10
Expansion slots1 differ
PCI Express x16 (Gen 5.x) slotsDiffers23
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design1 differ
Number of fansDiffers5 fan(s)8 fan(s)
Power3 differ
Power supplyDiffers800 W1300 W
Input currentDiffers5 - 10 A7 - 12 A
DC output current (+12 V)Differs65 A80.5 A
Weight & dimensions2 differ
DepthDiffers520 mm815 mm
WeightDiffers13.2 kg21.2 kg
Packaging data5 differ
Packaging contentDiffers1 x E163-S30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R143-EG2-AAC2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x GPU power cable (16-pin, 450mm); 1 x 2-Section Rail kit
Package widthDiffers787 mm1038 mm
Package depthDiffers594 mm588 mm
Package heightDiffers226 mm238 mm
Package weightDiffers15 kg26.2 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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