Product comparison · 2 server barebones

GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel vs GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel

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  • 59specifications compared
  • 21differ
  • 38identical
  • 4known for one product only

Key differences

The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 12 more DIMM slots than the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel (16 vs 4). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: Intel C741 on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, Intel C262 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel. Processor socket: LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel, LGA 1700 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
  • Processor socket
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
  • Number of DIMM slots
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Memory channels
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
  • Number of storage drives supported
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:3
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:2.5,M.2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:2.5,M.2,3.5
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:3
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4

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Differences highlightedShow differences only (on)
Comparison of E163-S30-AAB1, R133-X10-AAA2
63 specifications
Processor2 differ
Motherboard chipsetDiffersIntel C741Intel C262
Processor socketDiffersLGA 4677 (Socket E)LGA 1700
Intel Xeon seriesKnown for oneUnknown — not stated by the sourceE-2400
Memory2 differ
Number of DIMM slotsDiffers164
Memory channelsDiffersOcta-channelDual-channel
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)Serial ATA, PCI Express 4.0
RAID levelsKnown for oneUnknown — not stated by the source0, 1, 10, 5
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers12
Expansion slotsidentical
PCI Express x4 slotsKnown for oneUnknown — not stated by the source1
Featuresidentical
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design1 differ
Number of fansDiffers5 fan(s)4 fan(s)
Power3 differ
Power supplyDiffers800 W550 W
Input currentDiffers5 - 10 A4 - 8 A
DC output current (+12 V)Differs65 A44 A
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers13.2 kg17.5 kg
Packaging data4 differ
Packaging contentDiffers1 x E163-S30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers1 x R133-X10-AAA2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightDiffers15 kg19.5 kg

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