Product comparison · 2 server barebones

GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel

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  • 57specifications compared
  • 21differ
  • 36identical
  • 7known for one product only

Key differences

The GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel has 8 more DIMM slots than the GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel (12 vs 4). The GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: Intel SoC on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, Intel C262 on the GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, LGA 1700 on the GIGABYTE R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Intel SoC
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
  • Processor socket
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
  • Number of DIMM slots
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:12
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Memory channels
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
  • Number of storage drives supported
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:3
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:2
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:2.5,M.2
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:2.5,M.2,3.5
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:3
    • R133-X13-AAB1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4

Side by side

Differences highlightedShow differences only (on)
Comparison of E143-E30-AAG1, R133-X13-AAB1
64 specifications
Processor3 differ
Motherboard chipsetDiffersIntel SoCIntel C262
Processor socketDiffersSocket SP6LGA 1700
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Intel Xeon seriesKnown for oneUnknown — not stated by the sourceE-2400
Memory2 differ
Number of DIMM slotsDiffers124
Memory channelsDiffersHexa-channelDual-channel
ECCKnown for oneUnknown — not stated by the sourceYes
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 4.0
RAID levelsKnown for oneUnknown — not stated by the source0, 1, 10, 5
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers12
Expansion slots1 differ
PCI Express x4 slotsKnown for oneUnknown — not stated by the source1
PCI Express x16 (Gen 5.x) slotsDiffers21
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design1 differ
Number of fansDiffers5 fan(s)6 fan(s)
Power1 differ
DC output current (+12 V)Known for oneUnknown — not stated by the source65 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers12.4 kg18 kg
Packaging data4 differ
Packaging contentDiffers1 x E143-E30-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R133-X13-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x GPU power cable (2x PCIe 8pin, 700mm); 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightDiffers14.8 kg20 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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