Product comparison · 2 server barebones

GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel

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  • 57specifications compared
  • 20differ
  • 37identical
  • 3known for one product only

Key differences

The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 4 more DIMM slots than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 1 more USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (4 vs 3). The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 4 cm more fan diameter than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (8 cm vs 4 cm). Motherboard chipset: Intel SoC on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Intel SoC
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
  • Processor socket
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
  • Number of DIMM slots
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:12
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
  • Memory channels
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:3
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:4
  • Chassis type
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Rack (1U)
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Rack (2U)
  • Fan diameter
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:4 cm
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:8 cm
  • Number of fans
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:5 fan(s)
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:4 fan(s)

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Differences highlightedShow differences only (on)
Comparison of E143-E30-AAG1, E263-S30-AAD1
60 specifications
Processor3 differ
Motherboard chipsetDiffersIntel SoCIntel C741
Processor socketDiffersSocket SP6LGA 4677 (Socket E)
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers1216
Memory channelsDiffersHexa-channelOcta-channel
Storage1 differ
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
RAID levelsKnown for oneUnknown — not stated by the source0, 1
Ports & interfaces1 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Design3 differ
Chassis typeDiffersRack (1U)Rack (2U)
Fan diameterDiffers4 cm8 cm
Number of fansDiffers5 fan(s)4 fan(s)
Power3 differ
Power supplyDiffers800 W1600 W
Input currentDiffers5 - 10 A10 - 12 A
DC output current (+12 V)Known for oneUnknown — not stated by the source133 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Weight & dimensions2 differ
HeightDiffers43.5 mm87.5 mm
WeightDiffers12.4 kg16 kg
Packaging data5 differ
Packaging contentDiffers1 x E143-E30-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x E263-S30-AAD1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers
Package widthDiffers787 mm732 mm
Package depthDiffers594 mm588 mm
Package heightDiffers226 mm285 mm
Package weightDiffers14.8 kg18.8 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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