Product comparison · 2 server barebones

GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

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  • 57specifications compared
  • 10differ
  • 47identical
  • 2known for one product only

Key differences

The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 4 more DIMM slots than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 0.8 kg more weight than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (13.2 kg vs 12.4 kg). The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 0.2 kg more package weight than the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel (15 kg vs 14.8 kg). Motherboard chipset: Intel SoC on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Intel SoC
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
  • Processor socket
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
  • Number of DIMM slots
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:12
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
  • Memory channels
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
  • 80 PLUS certification
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:80 PLUS Titanium
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:80 PLUS Platinum
  • Weight
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:12.4 kg
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:13.2 kg
  • Package weight
    • E143-E30-AAG1 Intel SoC Socket SP6 Rack (1U) Black, Steel:14.8 kg
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:15 kg

Side by side

Differences highlightedShow differences only (on)
Comparison of E143-E30-AAG1, E163-S30-AAB1
59 specifications
Processor3 differ
Motherboard chipsetDiffersIntel SoCIntel C741
Processor socketDiffersSocket SP6LGA 4677 (Socket E)
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers1216
Memory channelsDiffersHexa-channelOcta-channel
Storage1 differ
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Power1 differ
DC output current (+12 V)Known for oneUnknown — not stated by the source65 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Weight & dimensions1 differ
WeightDiffers12.4 kg13.2 kg
Packaging data2 differ
Packaging contentDiffers1 x E143-E30-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x E163-S30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers
Package weightDiffers14.8 kg15 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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