Product comparison · 2 server barebones

GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel

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  • 58specifications compared
  • 22differ
  • 36identical
  • 5known for one product only

Key differences

The GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 8 more DIMM slots than the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel (12 vs 4). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more storage drives supported than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (5 vs 3). The GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel has 2 more 2.5" bays than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (4 vs 2). Motherboard chipset: AMD SoC on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, Intel C262 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, LGA 1700 on the GIGABYTE R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
  • Processor socket
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
  • Number of DIMM slots
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Memory channels
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
  • Number of storage drives supported
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:3
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:5
  • Number of 2.5" bays
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
  • Storage drive sizes supported
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:2.5,M.2
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:2.5,M.2,3.5
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:3
    • R133-X10-AAA2 Intel C262 LGA 1700 Rack (1U) Black, Steel:4

Side by side

Differences highlightedShow differences only (on)
Comparison of E143-E30-AAB1, R133-X10-AAA2
63 specifications
Processor3 differ
Motherboard chipsetDiffersAMD SoCIntel C262
Processor socketDiffersSocket SP6LGA 1700
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Intel Xeon seriesKnown for oneUnknown — not stated by the sourceE-2400
Memory2 differ
Number of DIMM slotsDiffers124
Memory channelsDiffersHexa-channelDual-channel
Storage4 differ
Number of storage drives supportedDiffers35
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,M.2,3.5
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 4.0
RAID levelsKnown for oneUnknown — not stated by the source0, 1, 10, 5
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers12
Expansion slotsidentical
PCI Express x4 slotsKnown for oneUnknown — not stated by the source1
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Design1 differ
Number of fansDiffers5 fan(s)4 fan(s)
Power3 differ
Power supplyDiffers800 W550 W
Input currentDiffers4 - 10 A4 - 8 A
DC output current (+12 V)Differs66 A44 A
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 35 °C10 - 30 °C
Weight & dimensions2 differ
DepthDiffers520 mm710 mm
WeightDiffers12.4 kg17.5 kg
Packaging data4 differ
Packaging contentDiffers1 x E143-E30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R133-X10-AAA2; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 1 x 2-Section Rail kit
Package widthDiffers787 mm982 mm
Package heightDiffers226 mm250 mm
Package weightDiffers14.8 kg19.5 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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