Product comparison · 2 server barebones

GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel vs GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

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  • 58specifications compared
  • 11differ
  • 47identical
  • 1known for one product only

Key differences

The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 4 more DIMM slots than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (16 vs 12). The GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 1 - 10 A more input current than the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel (5 - 10 A vs 4 - 10 A). The GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel has 1 A more DC output current (+12 V) than the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel (66 A vs 65 A). Motherboard chipset: AMD SoC on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel. Processor socket: Socket SP6 on the GIGABYTE E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel.

  • Motherboard chipset
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:AMD SoC
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Intel C741
  • Processor socket
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Socket SP6
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:LGA 4677 (Socket E)
  • Number of DIMM slots
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:16
  • Memory channels
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:Hexa-channel
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:Octa-channel
  • Input current
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:4 - 10 A
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:5 - 10 A
  • DC output current (+12 V)
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:66 A
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:65 A
  • Weight
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:12.4 kg
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:13.2 kg
  • Package weight
    • E143-E30-AAB1 AMD SoC Socket SP6 Rack (1U) Black, Steel:14.8 kg
    • E163-S30-AAB1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel:15 kg

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Differences highlightedShow differences only (on)
Comparison of E143-E30-AAB1, E163-S30-AAB1
59 specifications
Processor3 differ
Motherboard chipsetDiffersAMD SoCIntel C741
Processor socketDiffersSocket SP6LGA 4677 (Socket E)
Compatible processor seriesDiffersAMD EPYC 8004, AMD EPYC 8005 SeriesIntel® Xeon®
Memory2 differ
Number of DIMM slotsDiffers1216
Memory channelsDiffersHexa-channelOcta-channel
Storage1 differ
Supported storage drive interfacesDiffersSerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)-4Serial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Power2 differ
Input currentDiffers4 - 10 A5 - 10 A
DC output current (+12 V)Differs66 A65 A
Weight & dimensions1 differ
WeightDiffers12.4 kg13.2 kg
Packaging data2 differ
Packaging contentDiffers1 x E143-E30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x E163-S30-AAB1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers
Package weightDiffers14.8 kg15 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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