Product comparison · 2 server barebones

GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel vs GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel

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  • 58specifications compared
  • 21differ
  • 37identical
  • 5known for one product only

Key differences

The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 12 more DIMM slots than the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel (16 vs 4). The GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel has 1 more USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity than the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel (4 vs 3). The GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel has 1 more Ethernet LAN (RJ-45) ports than the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel (2 vs 1). Motherboard chipset: Intel C262 on the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel. Processor socket: LGA 1700 on the GIGABYTE E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel.

  • Motherboard chipset
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Intel C741
  • Processor socket
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:LGA 4677 (Socket E)
  • Number of DIMM slots
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:16
  • Memory channels
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Octa-channel
  • USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:3
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:4
  • Ethernet LAN (RJ-45) ports
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:2
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:1
  • PCI Express x16 (Gen 5.x) slots
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:1
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:2
  • Chassis type
    • E133-X10-AAG1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Rack (1U)
    • E263-S30-AAD1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Steel:Rack (2U)

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Differences highlightedShow differences only (on)
Comparison of E133-X10-AAG1, E263-S30-AAD1
63 specifications
Processor3 differ
Motherboard chipsetDiffersIntel C262Intel C741
Processor socketDiffersLGA 1700LGA 4677 (Socket E)
Compatible processor seriesDiffersIntel Xeon E, Intel Xeon 6300Intel® Xeon®
Intel Xeon seriesKnown for oneE-2400, 6300Unknown — not stated by the source
Memory2 differ
Number of DIMM slotsDiffers416
Memory channelsDiffersDual-channelOcta-channel
ECCKnown for oneYesUnknown — not stated by the source
Storage1 differ
Supported storage drive interfacesDiffersSerial ATASerial ATA, PCI Express 3.0, Serial Attached SCSI (SAS)
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers21
Expansion slots1 differ
PCI Express x4 slotsKnown for one1Unknown — not stated by the source
PCI Express x16 (Gen 5.x) slotsDiffers12
Design2 differ
Chassis typeDiffersRack (1U)Rack (2U)
Fan diameterDiffers4 cm8 cm
Power3 differ
Power supplyDiffers800 W1600 W
Input currentDiffers5 - 10 A10 - 12 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
DC output current (+12 V)Known for oneUnknown — not stated by the source133 A
Weight & dimensions2 differ
HeightDiffers43.5 mm87.5 mm
WeightDiffers12.1 kg16 kg
Packaging data5 differ
Packaging contentDiffers1 x E133-X10-AAG1;1 x CPU heatsink;1 x Mini-DP to D-Sub cable1 x E263-S30-AAD1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable; 3 x Carriers
Package widthDiffers787 mm732 mm
Package depthDiffers594 mm588 mm
Package heightDiffers226 mm285 mm
Package weightDiffers14 kg18.8 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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