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Product comparison · 2 server barebones

GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel vs GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

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  • 52specifications compared
  • 29differ
  • 23identical
  • 16known for one product only

Key differences

The GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 1 more processors supported than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (2 vs 1). The GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 28 more DIMM slots than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (32 vs 4). The GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel has 1 more storage drives supported than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (4 vs 3). Motherboard chipset: Intel C262 on the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel. Processor socket: LGA 1700 on the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel.

  • Motherboard chipset
    • Intel C262
    • Intel C741
  • Processor socket
    • LGA 1700
    • LGA 4677 (Socket E)
  • Number of processors supported
    • 1
    • 2
  • Compatible processor series
    • Intel Xeon E
    • Intel® Xeon®
  • Number of DIMM slots
    • 4
    • 32
  • Supported memory types
    • DDR5-SDRAM
    • GDDR5
  • Memory channels
    • Dual-channel
    • Octa-channel
  • Number of storage drives supported
    • 3
    • 4

Side by side

Differences highlightedShow differences only
68 specifications
A

GIGABYTE

E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel

Model E133-X10-AAA1

View product
B

GIGABYTE

R183-S93-AAG1 Intel C741 LGA 4677 (Socket E) Rack (1U) Black, Steel

Model R183-S93-AAG1

View product
Processor4 differ
Motherboard chipsetDiffersIntel C262Intel C741
Processor socketDiffersLGA 1700LGA 4677 (Socket E)
Number of processors supportedDiffers12
Compatible processor seriesDiffersIntel Xeon EIntel® Xeon®
Intel Xeon seriesKnown for oneE-2400
Processor manufacturerKnown for oneIntel
Processor familyKnown for oneIntel® Xeon®
Processor generationKnown for oneIntel Xeon Scalable 4th Gen
Memory3 differ
Number of DIMM slotsDiffers432
Supported memory typesDiffersDDR5-SDRAMGDDR5
Memory channelsDiffersDual-channelOcta-channel
ECCKnown for oneYes
Storage5 differ
Number of storage drives supportedDiffers34
Number of 2.5" baysDiffers24
Storage drive sizes supportedDiffers2.5,M.22.5,3.5"
Supported storage drive interfacesDiffersSerial ATASerial ATA, PCI Express 4.0
RAID levelsDiffers0, 10, 1, 5, 10
SSD form factorKnown for oneM.2
Graphicsidentical
Discrete graphics card modelKnown for oneNot available
Network1 differ
LAN controllerDiffersIntel® I210-ATIntel® I350-AM2
Ports & interfaces1 differ
USB 2.0 ports quantityKnown for one0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Expansion slotsidentical
PCI Express x4 slotsKnown for one1
PCI Express x16 (Gen 5.x) slotsKnown for one1
Number of M.2 (M) slotsKnown for one1
PCI Express slots versionKnown for one4.0
Design2 differ
LED indicatorsDiffersLAN, HDD, SSD, StatusHDD, LAN, Status
Heat sink includedKnown for oneYes
Number of fansDiffers4 fan(s)8 fan(s)
Power4 differ
Power supplyDiffers550 W850 W
Number of redundant power supplies supportedDiffers21
Number of redundant power supplies installedKnown for one2
Input currentDiffers4 - 8 A5 - 11 A
DC output current (+12 V)Known for one44 A
80 PLUS certificationDiffers80 PLUS Platinum80 PLUS Titanium
Operational conditions1 differ
Operating temperature (T-T)Differs10 - 30 °C10 - 35 °C
Weight & dimensions3 differ
DepthDiffers520 mm815 mm
HeightDiffers43.5 mm435 mm
WeightDiffers12.3 kg22.7 kg
Packaging data5 differ
Packaging contentDiffers1 x E133-X10-AAA1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R183-S93-AAG1 2 x CPU heatsinks 1 x Mini-DP to D-Sub cable 6 x Carriers 1 x 2-Section Rail kit
Package widthDiffers787 mm1052 mm
Package depthDiffers594 mm602 mm
Package heightDiffers226 mm267 mm
Package weightDiffers14.3 kg27.7 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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