Product comparison · 2 server barebones

GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel vs GIGABYTE H262-Z6B Rev. A00

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  • 54specifications compared
  • 29differ
  • 25identical
  • 12known for one product only

Key differences

The GIGABYTE H262-Z6B Rev. A00 has 7 more processors supported than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (8 vs 1). The GIGABYTE H262-Z6B Rev. A00 has 60 more DIMM slots than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (64 vs 4). The GIGABYTE H262-Z6B Rev. A00 has 9 more storage drives supported than the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel (12 vs 3). Motherboard chipset: Intel C262 on the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel, AMD SoC on the GIGABYTE H262-Z6B Rev. A00. Processor socket: LGA 1700 on the GIGABYTE E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel, Socket SP3 on the GIGABYTE H262-Z6B Rev. A00.

  • Motherboard chipset
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel C262
    • H262-Z6B Rev. A00:AMD SoC
  • Processor socket
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:LGA 1700
    • H262-Z6B Rev. A00:Socket SP3
  • Number of processors supported
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:1
    • H262-Z6B Rev. A00:8
  • Compatible processor series
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Intel Xeon E
    • H262-Z6B Rev. A00:AMD EPYC 7002, AMD EPYC 7003
  • Number of DIMM slots
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:4
    • H262-Z6B Rev. A00:64
  • Supported memory types
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:DDR5-SDRAM
    • H262-Z6B Rev. A00:DDR4-SDRAM
  • Memory channels
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:Dual-channel
    • H262-Z6B Rev. A00:Octa-channel
  • Number of storage drives supported
    • E133-X10-AAA1 Intel C262 LGA 1700 Rack (1U) Black, Steel:3
    • H262-Z6B Rev. A00:12

Side by side

Differences highlightedShow differences only (on)
Comparison of E133-X10-AAA1, H262-Z6B Rev. A00
66 specifications
Processor4 differ
Motherboard chipsetDiffersIntel C262AMD SoC
Processor socketDiffersLGA 1700Socket SP3
Number of processors supportedDiffers18
Compatible processor seriesDiffersIntel Xeon EAMD EPYC 7002, AMD EPYC 7003
Intel Xeon seriesKnown for oneE-2400Unknown — not stated by the source
Memory3 differ
Number of DIMM slotsDiffers464
Supported memory typesDiffersDDR5-SDRAMDDR4-SDRAM
Memory channelsDiffersDual-channelOcta-channel
ECCKnown for oneYesUnknown — not stated by the source
Storage3 differ
Number of storage drives supportedDiffers312
Number of 2.5" baysDiffers28
Supported storage drive interfacesDiffersSerial ATASerial ATA, Serial Attached SCSI (SAS), PCI Express 4.0
RAID levelsKnown for one0, 1Unknown — not stated by the source
Graphics1 differ
On-board graphics card modelDiffersAspeed AST2600Aspeed AST2500
Network1 differ
LAN controllerDiffersIntel® I210-ATIntel® I350-AM2
Ports & interfaces3 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers38
Ethernet LAN (RJ-45) portsDiffers28
Mini DisplayPorts quantityDiffers14
Expansion slots1 differ
PCI Express x4 slotsKnown for one1Unknown — not stated by the source
PCI Express x16 (Gen 5.x) slotsKnown for one1Unknown — not stated by the source
Number of M.2 (M) slotsDiffers14
PCI Express x16 (Gen 4.x) slotsKnown for oneUnknown — not stated by the source8
Design4 differ
Chassis typeDiffersRack (1U)Rack (2U)
LED indicatorsDiffersLAN, HDD, SSD, StatusStatus
Fan diameterDiffers4 cm8 cm
Number of fansDiffers4 fan(s)8 fan(s)
Power2 differ
Power supplyDiffers550 W2200 W
Input currentDiffers4 - 8 A12.6 - 14 A
DC output current (+12 V)Known for one44 AUnknown — not stated by the source
Weight & dimensions3 differ
DepthDiffers520 mm840 mm
HeightDiffers43.5 mm87.5 mm
WeightKnown for one12.3 kgUnknown — not stated by the source
WidthDiffers438 mm440 mm
Packaging data4 differ
Packaging contentDiffers1 x E133-X10-AAA1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x H262-Z6B; 8 x CPU heatsinks; 1 x 3-Section Rail kit
Package widthDiffers787 mm1180 mm
Package depthDiffers594 mm779 mm
Package heightDiffers226 mm300 mm
Package weightKnown for one14.3 kgUnknown — not stated by the source
Featuresidentical
Trusted Platform Module (TPM)Known for oneUnknown — not stated by the sourceYes
Backplanes supportKnown for oneUnknown — not stated by the sourceYes
Compatible operating systemsKnown for oneUnknown — not stated by the sourceCitrix Hypervisor 8.2.0 or later; Red Hat Enterprise Linux 8.3 or later; Red Hat Enterprise Linux 9.0 or later; SUSE Linux Enterprise Server 12 SP5 or later; SUSE Linux Enterprise Server 15 SP2 or later; Ubuntu 18.04.5 LTS or later; Ubuntu 20.04 LTS or later; Ubuntu 22.04 LTS or later; VMware ESXi 6

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