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Product comparison · 2 server barebones

GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel vs GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey

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  • 49specifications compared
  • 31differ
  • 18identical
  • 18known for one product only

Key differences

The GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey has 1 more processors supported than the GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel (2 vs 1). The GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey has 12 more DIMM slots than the GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel (16 vs 4). The GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey has 10 more storage drives supported than the GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel (13 vs 3). Motherboard chipset: AMD B650E on the GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel, Intel C741 on the GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey. Processor socket: Socket AM5 on the GIGABYTE E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel, LGA 4677 (Socket E) on the GIGABYTE R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey.

  • Motherboard chipset
    • AMD B650E
    • Intel C741
  • Processor socket
    • Socket AM5
    • LGA 4677 (Socket E)
  • Number of processors supported
    • 1
    • 2
  • Number of DIMM slots
    • 4
    • 16
  • Supported memory types
    • DDR5-SDRAM
    • GDDR5
  • Memory channels
    • Dual-channel
    • Octa-channel
  • Number of storage drives supported
    • 3
    • 13
  • Number of 2.5" bays
    • 2
    • 12

Side by side

Differences highlightedShow differences only
67 specifications
A

GIGABYTE

E133-C10-AAG1 AMD B650E Socket AM5 Rack (1U) Black, Steel

Model E133-C10-AAG1

View product
B

GIGABYTE

R263-SG0-AAE1 Intel C741 LGA 4677 (Socket E) Rack (2U) Black, Grey

Model R263-SG0-AAE1

View product
Processor4 differ
Motherboard chipsetDiffersAMD B650EIntel C741
Processor socketDiffersSocket AM5LGA 4677 (Socket E)
Number of processors supportedDiffers12
Compatible processor seriesDiffersAMD Ryzen 9000 Series, AMD EPYC™ 4005 SeriesIntel® Xeon®
Processor manufacturerKnown for oneIntel
Processor familyKnown for oneIntel® Xeon®
Memory3 differ
Number of DIMM slotsDiffers416
Supported memory typesDiffersDDR5-SDRAMGDDR5
Memory channelsDiffersDual-channelOcta-channel
ECCKnown for oneYes
Non-ECCKnown for oneYes
Supported RDIMM clock speedsKnown for one5600,4400 MHz
Storage4 differ
Number of storage drives supportedDiffers313
Number of 2.5" baysDiffers212
Storage drive sizes supportedDiffers2.5,M.22.5,3.5"
Supported storage drive typesKnown for oneHDD & SSD
Supported storage drive interfacesKnown for oneSerial ATA
RAID levelsDiffers0, 10, 1, 5, 10
SSD form factorKnown for oneM.2
Number of 3.5" baysKnown for one12
Network1 differ
LAN controllerDiffersBroadcom BCM5720Intel® I210-AT
Ports & interfaces2 differ
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantityDiffers34
Ethernet LAN (RJ-45) portsDiffers21
Expansion slotsidentical
PCI Express x4 slotsKnown for one1
PCI Express x16 (Gen 5.x) slotsKnown for one1
Design5 differ
Chassis typeDiffersRack (1U)Rack (2U)
Product colourDiffersBlack, SteelBlack, Grey
LED indicatorsDiffersLAN, HDD, SSD, StatusHDD, LAN, Power, System
Fan diameterDiffers4 cm8 cm
Heat sink includedKnown for oneYes
Number of fansDiffers3 fan(s)4 fan(s)
Power3 differ
Power supplyDiffers800 W2000 W
Redundant power supply (RPS) supportKnown for oneYes
Number of redundant power supplies supportedKnown for one2
Number of redundant power supplies installedKnown for one2
Input currentDiffers5 - 10 A12 - 10 A
80 PLUS certificationDiffers80 PLUS Titanium80 PLUS Platinum
Operational conditions2 differ
Operating temperature (T-T)Differs10 - 30 °C10 - 35 °C
Storage relative humidity (H-H)Differs20 - 95%5 - 95%
Weight & dimensions3 differ
DepthDiffers520 mm815 mm
HeightDiffers43.5 mm87.5 mm
WeightDiffers12.4 kg27.8 kg
Packaging data4 differ
Packaging contentDiffers1 x E133-C10-AAG1; 1 x CPU heatsink; 1 x Mini-DP to D-Sub cable1 x R263-S30-AAC11 x CPU heatsink1 x Mini-DP to D-Sub cable3 x Carriers1 x 2-Section Rail kit
Package widthDiffers787 mm1075 mm
Package depthDiffers594 mm679 mm
Package heightDiffers226 mm300 mm
Package weightKnown for one32.8 kg
Featuresidentical
Trusted Platform Module (TPM)Known for oneYes
Backplanes supportKnown for oneYes

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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