Product comparison · 2 pcs/workstations

HP dc7900 CMT + iPAQ Voice Messenger vs HP dc7900 SFF + iPAQ Voice Messenger

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  • 96specifications compared
  • 26differ
  • 70identical
  • 8known for one product only

Key differences

  • Processor family
    • dc7900 CMT + iPAQ Voice Messenger:Intel® Core™2 Quad
    • dc7900 SFF + iPAQ Voice Messenger:Intel® Core™2 Duo
  • Processor model
    • dc7900 CMT + iPAQ Voice Messenger:Q9400
    • dc7900 SFF + iPAQ Voice Messenger:E8500
  • Processor cores
    • dc7900 CMT + iPAQ Voice Messenger:4
    • dc7900 SFF + iPAQ Voice Messenger:2
  • Processor threads
    • dc7900 CMT + iPAQ Voice Messenger:4
    • dc7900 SFF + iPAQ Voice Messenger:2
  • Processor frequency
    • dc7900 CMT + iPAQ Voice Messenger:2.66 GHz
    • dc7900 SFF + iPAQ Voice Messenger:3.16 GHz
  • Processor codename
    • dc7900 CMT + iPAQ Voice Messenger:Yorkfield
    • dc7900 SFF + iPAQ Voice Messenger:Wolfdale
  • Thermal Design Power (TDP)
    • dc7900 CMT + iPAQ Voice Messenger:95 W
    • dc7900 SFF + iPAQ Voice Messenger:65 W
  • Tcase
    • dc7900 CMT + iPAQ Voice Messenger:71.4 °C
    • dc7900 SFF + iPAQ Voice Messenger:72.4 °C

Side by side

Differences highlightedShow differences only (on)
Comparison of dc7900 CMT + iPAQ Voice Messenger, dc7900 SFF + iPAQ Voice Messenger
104 specifications
Processor13 differ
Processor familyDiffersIntel® Core™2 QuadIntel® Core™2 Duo
Processor modelDiffersQ9400E8500
Processor coresDiffers42
Processor threadsDiffers42
Processor frequencyDiffers2.66 GHz3.16 GHz
Processor seriesDiffersIntel Core 2 Quad Q9000 Series for DesktopIntel Core 2 Duo E8000 Series
Processor codenameDiffersYorkfieldWolfdale
Thermal Design Power (TDP)Differs95 W65 W
TcaseDiffers71.4 °C72.4 °C
Number of Processing Die TransistorsDiffers456 M410 M
Processing Die sizeDiffers164 mm²107 mm²
CPU multiplier (bus/core ratio)Differs89.5
SteppingDiffersR0C0
Processor system typeKnown for oneUnknown — not stated by the sourceDP
Processor core voltage (AC)Known for oneUnknown — not stated by the source0.850/1.3625 V
Memoryidentical
Memory layout (slots x size)Known for one2 x 1 GBUnknown — not stated by the source
Storage1 differ
Total storage capacityDiffers500 GB250 GB
Graphicsidentical
Graphics card familyKnown for oneUnknown — not stated by the sourceIntel
Expansion slots2 differ
PCI Express x16 slotsDiffers12
Expansion slotsDiffers3 x PCI1 x PCI
Power1 differ
Power consumption (typical)Differs365 W240 W
Design2 differ
Chassis typeDiffersMini TowerSFF
Cable lock slotKnown for oneYesUnknown — not stated by the source
Cable lock slot typeKnown for oneKensingtonUnknown — not stated by the source
External drive baysDiffers3 x 5.25", 1 x 3.5"1 x 5.25", 1 x 3.5"
Processor special features3 differ
Embedded options availableDiffersYesNo
Processor ARK IDDiffers3536533911
Processor codeDiffersSLB6BSLAPK
Operational conditionsidentical
Relative humidityKnown for one10 - 90%Unknown — not stated by the source
Non-operating relative humidity (non-condensing)Known for one5 - 90%Unknown — not stated by the source
Weight & dimensions4 differ
WidthDiffers177 mm337 mm
DepthDiffers452 mm378 mm
HeightDiffers447 mm100 mm
WeightDiffers11.8 kg8.5 kg

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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