Product comparison · 2 pcs/workstations

Fujitsu CELSIUS W360 Intel® Core™2 Duo E6550 vs HP dc7800 Intel® Core™2 Duo E6550

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  • 74specifications compared
  • 8differ
  • 66identical
  • 16known for one product only

Key differences

  • Internal memory
    • CELSIUS W360 Intel® Core™2 Duo E6550:2 GB
    • dc7800 Intel® Core™2 Duo E6550:1 GB
  • Product type
    • CELSIUS W360 Intel® Core™2 Duo E6550:Workstation
    • dc7800 Intel® Core™2 Duo E6550:PC
  • USB 2.0 ports quantity
    • CELSIUS W360 Intel® Core™2 Duo E6550:10
    • dc7800 Intel® Core™2 Duo E6550:8
  • Operating system installed
    • CELSIUS W360 Intel® Core™2 Duo E6550:Windows Vista Business
    • dc7800 Intel® Core™2 Duo E6550:Windows XP Professional
  • Width
    • CELSIUS W360 Intel® Core™2 Duo E6550:203 mm
    • dc7800 Intel® Core™2 Duo E6550:163 mm
  • Depth
    • CELSIUS W360 Intel® Core™2 Duo E6550:426 mm
    • dc7800 Intel® Core™2 Duo E6550:458 mm
  • Height
    • CELSIUS W360 Intel® Core™2 Duo E6550:442 mm
    • dc7800 Intel® Core™2 Duo E6550:25 mm
  • Weight
    • CELSIUS W360 Intel® Core™2 Duo E6550:16 kg
    • dc7800 Intel® Core™2 Duo E6550:8.5 kg

Side by side

Differences highlightedShow differences only (off)
Comparison of W360, dc7800
90 specifications
Processoridentical
Processor manufacturerIntelIntel
Processor familyIntel® Core™2 DuoIntel® Core™2 Duo
Processor modelE6550E6550
Processor cores22
Processor threads22
Processor frequency2.33 GHz2.33 GHz
Processor cache4 MB4 MB
Processor cache typeL2L2
Processor front side bus1333 MHz1333 MHz
Bus typeFSBFSB
FSB ParityNoNo
Processor lithography65 nm65 nm
Processor operating modes64-bit64-bit
Processor seriesIntel Core 2 Duo E6000 SeriesIntel Core 2 Duo E6000 Series
Processor codenameConroeConroe
Thermal Design Power (TDP)65 W65 W
Tcase72 °C72 °C
Processor socketLGA 775 (Socket T)LGA 775 (Socket T)
Number of Processing Die Transistors291 M291 M
Processing Die size143 mm²143 mm²
CPU multiplier (bus/core ratio)77
SteppingG0G0
ECC supported by processorNoNo
Memory1 differ
Internal memoryDiffers2 GB1 GB
Maximum internal memoryKnown for oneUnknown — not stated by the source8 GB
Internal memory typeDDR2-SDRAMDDR2-SDRAM
Memory layout (slots x size)Known for one2 x 1 GBUnknown — not stated by the source
Storageidentical
Total storage capacityKnown for oneUnknown — not stated by the source160 GB
Optical drive typeKnown for oneUnknown — not stated by the sourceDVD±RW
HDD interfaceSATA IISATA II
HDD speedKnown for oneUnknown — not stated by the source7200 RPM
HDD capacityKnown for one250 GBUnknown — not stated by the source
Graphicsidentical
Discrete graphics card modelKnown for oneUnknown — not stated by the sourceIntel® GMA 3100
Performance1 differ
Product typeDiffersWorkstationPC
Motherboard chipsetKnown for oneIntel® Q35 ExpressUnknown — not stated by the source
Networkidentical
Networking featuresKnown for oneUnknown — not stated by the sourceGigabit Ethernet
Ports & interfaces1 differ
USB 2.0 ports quantityDiffers108
Ethernet LAN (RJ-45) ports11
Headphone outputs11
Microphone inYesYes
VGA (D-Sub) ports quantity11
PS/2 ports quantity22
Serial ports quantity11
Parallel ports quantityKnown for oneUnknown — not stated by the source1
Designidentical
Chassis typeKnown for oneUnknown — not stated by the sourceSFF
Country of originKnown for oneUnknown — not stated by the sourceChina
Software1 differ
Operating system installedDiffersWindows Vista BusinessWindows XP Professional
Displayidentical
Display includedNoNo
Processor special featuresidentical
Embedded options availableNoNo
Enhanced Intel SpeedStep TechnologyYesYes
Execute Disable BitYesYes
Idle StatesYesYes
Intel 64YesYes
Intel Clear Video TechnologyNoNo
Intel Demand Based SwitchingNoNo
Intel Dual Display Capable TechnologyNoNo
Intel Enhanced Halt StateYesYes
Intel FDI TechnologyNoNo
Intel Fast Memory AccessNoNo
Intel Flex Memory AccessNoNo
Intel Rapid Storage TechnologyNoNo
Intel Trusted Execution TechnologyYesYes
Intel VT-x with Extended Page Tables (EPT)NoNo
Intel Virtualization Technology (VT-x)YesYes
Intel Virtualization Technology for Directed I/O (VT-d)NoNo
Intel® AES New Instructions (Intel® AES-NI)NoNo
Intel® Clear Video HD Technology (Intel® CVT HD)NoNo
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)NoNo
Intel® InTru™ 3D TechnologyNoNo
Intel® Insider™NoNo
Intel® Wireless Display (Intel® WiDi)NoNo
Processor ARK ID3078330783
Processor codeSLA9XSLA9X
Processor package size37.5 x 37.5 mm37.5 x 37.5 mm
Thermal Monitoring TechnologiesYesYes
Intel® Turbo Boost TechnologyNoNo
Intel® Hyper Threading Technology (Intel® HT Technology)NoNo
Intel® Quick Sync Video TechnologyNoNo
Intel® My WiFi Technology (Intel® MWT)NoNo
Intel® Anti-Theft Technology (Intel® AT)NoNo
Conflict-Free processorNoNo
Audioidentical
Audio systemHigh Definition AudioHigh Definition Audio
Weight & dimensions4 differ
WidthDiffers203 mm163 mm
DepthDiffers426 mm458 mm
HeightDiffers442 mm25 mm
WeightDiffers16 kg8.5 kg
Expansion slotsidentical
Expansion slotsKnown for one4 x PCI 1 x PCI Express x16 1 x PCI Express x4 1 x PCI Express x1Unknown — not stated by the source
Operational conditionsidentical
Operating temperature (T-T)Known for one15 - 35 °CUnknown — not stated by the source
Operating relative humidity (H-H)Known for one20 - 75%Unknown — not stated by the source
Certificatesidentical
CertificationKnown for oneIEC60950, UL60950, CSA C22.2 No. 60950 GS EK1-ITB2001 EN55022 / CISPR22, EN5524 / CISPR24 EN61000-3-2/-3, CSA C108.8 IEC60601-1-2(4), ICES 003 FCC class B CE mark 89/336/EEC 73/23/EECUnknown — not stated by the source

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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