Product comparison · 2 memory modules

Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen vs Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor

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  • 13specifications compared
  • 5differ
  • 8identical
  • 0known for one product only

Key differences

The Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor has 2 GB more internal memory than the Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen (6 GB vs 4 GB). The Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor has 2 more CAS latency than the Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen (9 vs 7). The Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen has 256 M X 72 more module configuration than the Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor (512M X 72 vs 256M X 72). Memory layout (modules x size): 1 x 4 GB on the Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen, 3 x 2 GB on the Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor. Buffered memory type: Registered (buffered) on the Kingston Technology 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen, Unregistered (unbuffered) on the Kingston Technology 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor.

  • Internal memory
    • 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen:4 GB
    • 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:6 GB
  • Memory layout (modules x size)
    • 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen:1 x 4 GB
    • 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:3 x 2 GB
  • CAS latency
    • 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen:7
    • 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:9
  • Buffered memory type
    • 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen:Registered (buffered)
    • 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:Unregistered (unbuffered)
  • Module configuration
    • 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen:512M X 72
    • 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:256M X 72

Side by side

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Comparison of 4GB, 1066MHz, DDR3, ECC Reg w/Parity CL7 DIMM Quad Rank, x8 w/Therm Sen, 6GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor
13 specifications
Features5 differ
Internal memoryDiffers4 GB6 GB
Memory layout (modules x size)Differs1 x 4 GB3 x 2 GB
Internal memory typeDDR3DDR3
Memory form factor240-pin DIMM240-pin DIMM
ECCYesYes
CAS latencyDiffers79
Memory bus72 bit72 bit
Buffered memory typeDiffersRegistered (buffered)Unregistered (unbuffered)
Memory voltage1.5 V1.5 V
Module configurationDiffers512M X 72256M X 72
Memory typeDDR3DDR3
Lead platingGoldGold
Other featuresidentical
Chips organisationX8X8

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