Product comparison · 2 memory modules

Kingston Technology 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor vs Kingston Technology 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor

13specifications compared
2differ
11identical
1known for one product only

Key differences

The Kingston Technology 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor has 4 GB more internal memory than the Kingston Technology 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor (12 GB vs 8 GB). The Kingston Technology 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor has 1 x 4 GB more memory layout (modules x size) than the Kingston Technology 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor (3 x 4 GB vs 2 x 4 GB).

Internal memory
- 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor:12 GB
- 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor:8 GB
Memory layout (modules x size)
- 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor:3 x 4 GB
- 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor:2 x 4 GB

Side by side

Differences highlightedShow differences only

Comparison of 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor, 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor
14 specifications	A Kingston Technology 12GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 3), DR, x4 w/Therm Sensor View product	B Kingston Technology 8GB, 1333MHz, DDR3, ECC, Reg w/Par CL9 DIMM (Kit of 2) DR, x4 w/Therm Sensor View product
Features2 differ
Internal memoryDiffers	12 GB	8 GB
Memory layout (modules x size)Differs	3 x 4 GB	2 x 4 GB
Internal memory type	DDR3	DDR3
Memory form factor	240-pin DIMM	240-pin DIMM
ECC	Yes	Yes
CAS latency	9	9
Memory bus	72 bit	72 bit
Buffered memory type	Registered (buffered)	Registered (buffered)
Memory voltage	1.5 V	1.5 V
Module configuration	512M X 72	512M X 72
Memory type	DDR3	DDR3
Lead plating	Gold	Gold
Logistics dataidentical
Harmonized System (HS) codeKnown for one	Unknown — not stated by the source	84733020
Other featuresidentical
Chips organisation	X4	X4

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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