Product comparison · 2 memory modules

HyperX 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL vs Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor

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  • 8specifications compared
  • 5differ
  • 3identical
  • 7known for one product only

Key differences

The HyperX 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL has 3 GB more internal memory than the Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor (6 GB vs 3 GB). The Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor has 1 more CAS latency than the HyperX 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL (9 vs 8). The HyperX 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL has 0.15 V more memory voltage than the Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor (1.65 V vs 1.5 V). Only the Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor has ECC. Memory layout (modules x size): 3 x 2 GB on the HyperX 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL, 3 x 1 GB on the Kingston Technology 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor.

  • Internal memory
    • 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL:6 GB
    • 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:3 GB
  • Memory layout (modules x size)
    • 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL:3 x 2 GB
    • 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:3 x 1 GB
  • ECC
    • 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL:No
    • 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:Yes
  • CAS latency
    • 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL:8
    • 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:9
  • Memory voltage
    • 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL:1.65 V
    • 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor:1.5 V

Side by side

Differences highlightedShow differences only (on)
Comparison of 6GB, 2000MHz, DDR3, Non-ECC CL8 (8-8-8) DIMM (Kit of 3) XMP Tall HS UL, 3GB 1333MHz DDR3 ECC CL9 DIMM (Kit of 3) with Thermal Sensor
15 specifications
Features5 differ
Internal memoryDiffers6 GB3 GB
Memory layout (modules x size)Differs3 x 2 GB3 x 1 GB
ECCDiffersNoYes
CAS latencyDiffers89
Memory busKnown for oneUnknown — not stated by the source72 bit
Buffered memory typeKnown for oneUnknown — not stated by the sourceUnregistered (unbuffered)
Memory voltageDiffers1.65 V1.5 V
Memory typeKnown for oneUnknown — not stated by the sourceDDR3
Memory clock speedKnown for one2000 MHzUnknown — not stated by the source
Other featuresidentical
Chips organisationKnown for oneUnknown — not stated by the sourceX8
Bus clock rateKnown for oneUnknown — not stated by the source1333 MHz
Form factorKnown for oneUnknown — not stated by the source240-pin DIMM

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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