Product comparison · 2 laptops

HP 840 WIN CH vs HP 850 DOS CH

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  • 150specifications compared
  • 19differ
  • 131identical
  • 4known for one product only

Key differences

  • Display diagonal
    • 840 WIN CH:35.6 cm (14")
    • 850 DOS CH:39.6 cm (15.6")
  • Processor family
    • 840 WIN CH:Intel® Core™ i7
    • 850 DOS CH:Intel® Core™ i5
  • Processor generation
    • 840 WIN CH:8th gen Intel® Core™ i7
    • 850 DOS CH:8th gen Intel® Core™ i5
  • Processor model
    • 840 WIN CH:i7-8550U
    • 850 DOS CH:i5-8250U
  • Processor boost frequency
    • 840 WIN CH:4 GHz
    • 850 DOS CH:3.4 GHz
  • Processor frequency
    • 840 WIN CH:1.8 GHz
    • 850 DOS CH:1.6 GHz
  • Processor cache
    • 840 WIN CH:8 MB
    • 850 DOS CH:6 MB
  • Configurable TDP-up frequency
    • 840 WIN CH:2 GHz
    • 850 DOS CH:1.8 GHz

Side by side

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Comparison of 840 WIN CH, 850 DOS CH
154 specifications
Designidentical
Product typeLaptopLaptop
Product colourSilverSilver
Form factorClamshellClamshell
Market positioningBusinessBusiness
Country of originChinaChina
Display1 differ
Display diagonalDiffers35.6 cm (14")39.6 cm (15.6")
Display resolution3840 x 2160 pixels3840 x 2160 pixels
TouchscreenNoNo
HD type4K Ultra HD4K Ultra HD
Panel typeIPSIPS
LED backlightYesYes
Native aspect ratio16:916:9
Display brightness400 cd/m²400 cd/m²
Processor7 differ
Processor manufacturerIntelIntel
Processor familyDiffersIntel® Core™ i7Intel® Core™ i5
Processor generationDiffers8th gen Intel® Core™ i78th gen Intel® Core™ i5
Processor modelDiffersi7-8550Ui5-8250U
Processor cores44
Processor threads88
Processor boost frequencyDiffers4 GHz3.4 GHz
Processor frequencyDiffers1.8 GHz1.6 GHz
System bus rate4 GT/s4 GT/s
Processor cacheDiffers8 MB6 MB
Processor cache typeSmart CacheSmart Cache
Processor socketBGA 1356BGA 1356
Processor lithography14 nm14 nm
Processor operating modes64-bit64-bit
Processor codenameKaby Lake RKaby Lake R
Bus typeOPIOPI
SteppingY0Y0
Thermal Design Power (TDP)15 W15 W
Configurable TDP-up frequencyDiffers2 GHz1.8 GHz
Configurable TDP-up25 W25 W
Configurable TDP-down10 W10 W
Configurable TDP-down frequency0.8 GHz0.8 GHz
Tjunction100 °C100 °C
Maximum number of PCI Express lanes1212
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x11x2+2x1, 1x4, 2x2, 4x1
PCI Express slots version3.03.0
ECC supported by processorNoNo
Memory2 differ
Internal memoryDiffers16 GB8 GB
Internal memory typeDDR4-SDRAMDDR4-SDRAM
Memory clock speed2400 MHz2400 MHz
Memory form factorSO-DIMMSO-DIMM
Memory layout (slots x size)Differs1 x 16 GB1 x 8 GB
Memory slots2x SO-DIMM2x SO-DIMM
Maximum internal memory32 GB32 GB
Storageidentical
Total storage capacity512 GB512 GB
Storage mediaSSDSSD
Total SSDs capacity512 GB512 GB
Number of SSDs installed11
SSD capacity512 GB512 GB
NVMeYesYes
SSD interfaceNVMe 3.0, PCI ExpressNVMe 3.0, PCI Express
Optical drive typeNoNo
Card reader integratedNoNo
Graphics1 differ
On-board graphics cardYesYes
Discrete graphics cardNoNo
Discrete graphics card modelNot availableNot available
On-board graphics card familyIntel® UHD GraphicsIntel® UHD Graphics
On-board graphics card modelIntel® UHD Graphics 620Intel® UHD Graphics 620
Maximum on-board graphics card memory32 GB32 GB
On-board graphics card base frequency300 MHz300 MHz
On-board graphics card dynamic frequency (max)Differs1150 MHz1100 MHz
On-board graphics card DirectX version12.012.0
On-board graphics card OpenGL version4.44.4
On-board graphics card ID0x59170x5917
Audioidentical
Audio systemBang & OlufsenBang & Olufsen
Number of built-in speakers22
Built-in microphoneYesYes
Number of microphones33
Cameraidentical
Front cameraYesYes
Front camera HD typeHDHD
Front camera signal format720p720p
Infrared (IR) cameraYesYes
Networkidentical
Wi-FiYesYes
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Ethernet LANYesYes
Ethernet LAN data rates10,100,1000 Mbit/s10,100,1000 Mbit/s
BluetoothYesYes
Bluetooth version4.24.2
Ports & interfacesidentical
USB 2.0 ports quantity00
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity22
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity11
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity00
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity00
Ethernet LAN (RJ-45) ports11
HDMI ports quantity11
HDMI version1.4b1.4b
DisplayPorts quantity00
Thunderbolt 3 ports quantity00
Combo headphone/mic portYesYes
Docking connectorYesYes
SmartCard slotYesYes
Keyboard1 differ
Pointing deviceClickpadClickpad
Numeric keypadDiffersNoYes
Spill-resistant keyboardYesYes
Keyboard layoutQWERTZQWERTZ
Keyboard languageSwissSwiss
Software1 differ
Operating system installedDiffersWindows 10 ProFreeDOS
Operating system architectureKnown for one64-bitUnknown — not stated by the source
Processor special features1 differ
CPU configuration (max)11
Embedded options availableNoNo
Enhanced Intel SpeedStep TechnologyYesYes
Execute Disable BitYesYes
Idle StatesYesYes
Intel 64YesYes
Intel Clear Video TechnologyYesYes
Intel Enhanced Halt StateYesYes
Intel Flex Memory AccessYesYes
Intel Identity Protection Technology version1.001.00
Intel Secure Key Technology version1.001.00
Intel Smart Response Technology version1.001.00
Intel Software Guard Extensions (Intel SGX)YesYes
Intel Stable Image Platform Program (SIPP)Known for oneUnknown — not stated by the sourceNo
Intel Stable Image Platform Program (SIPP) versionKnown for oneUnknown — not stated by the source0.00
Intel TSX-NINoNo
Intel TSX-NI version0.000.00
Intel Trusted Execution TechnologyNoNo
Intel VT-x with Extended Page Tables (EPT)YesYes
Intel Virtualization Technology (VT-x)YesYes
Intel Virtualization Technology for Directed I/O (VT-d)YesYes
Intel® AES New Instructions (Intel® AES-NI)YesYes
Intel® Clear Video HD Technology (Intel® CVT HD)YesYes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)YesYes
Intel® Hyper Threading Technology (Intel® HT Technology)YesYes
Intel® Identity Protection Technology (Intel® IPT)YesYes
Intel® InTru™ 3D TechnologyYesYes
Intel® My WiFi Technology (Intel® MWT)YesYes
Intel® OS GuardYesYes
Intel® Quick Sync Video TechnologyYesYes
Intel® Secure KeyYesYes
Intel® Smart Response TechnologyYesYes
Intel® Turbo Boost Technology2.02.0
Processor ARK IDDiffers122589124967
Processor codeKnown for oneUnknown — not stated by the sourceSR3LA
Processor package size42 x 24 mm42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2AVX 2.0, SSE4.1, SSE4.2
Thermal Monitoring TechnologiesYesYes
Conflict-Free processorYesYes
Battery1 differ
Battery technologyLithium-Ion (Li-Ion)Lithium-Ion (Li-Ion)
Number of battery cells33
Battery capacityDiffers50 Wh56 Wh
Poweridentical
AC adapter power65 W65 W
DC-in jackYesYes
Securityidentical
Cable lock slotYesYes
Fingerprint readerYesYes
Trusted Platform Module (TPM)YesYes
Password protectionYesYes
Sustainabilityidentical
Sustainability certificatesENERGY STARENERGY STAR
Weight & dimensions4 differ
WeightDiffers1.48 kg1.78 kg
WidthDiffers326 mm370 mm
DepthDiffers234 mm252 mm
HeightDiffers17.9 mm18.3 mm

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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