Product comparison · 2 cpus

HP E5630 SL170 G6 FIO Kit vs HP X5690 processor

Key differences

Processor model
- E5630 SL170 G6 FIO Kit:E5630
- X5690 processor:X5690
Processor base frequency
- E5630 SL170 G6 FIO Kit:2.53 GHz
- X5690 processor:3.46 GHz
Processor cores
- E5630 SL170 G6 FIO Kit:4
- X5690 processor:6
Processor threads
- E5630 SL170 G6 FIO Kit:8
- X5690 processor:12
System bus rate
- E5630 SL170 G6 FIO Kit:5.86 GT/s
- X5690 processor:6.4 GT/s
Processor boost frequency
- E5630 SL170 G6 FIO Kit:2.8 GHz
- X5690 processor:3.73 GHz
Thermal Design Power (TDP)
- E5630 SL170 G6 FIO Kit:80 W
- X5690 processor:130 W
CPU multiplier (bus/core ratio)
- E5630 SL170 G6 FIO Kit:19
- X5690 processor:26

Differences highlightedShow differences only

Comparison of E5630 SL170 G6 FIO Kit, X5690
27 specifications	A HP E5630 SL170 G6 FIO Kit View product	B HP X5690 processor Model X5690 View product
Processor9 differ
Processor modelDiffers	E5630	X5690
Processor base frequencyDiffers	2.53 GHz	3.46 GHz
Processor coresDiffers	4	6
Processor threadsDiffers	8	12
System bus rateDiffers	5.86 GT/s	6.4 GT/s
Processor boost frequencyDiffers	2.8 GHz	3.73 GHz
Thermal Design Power (TDP)Differs	80 W	130 W
CPU multiplier (bus/core ratio)Differs	19	26
Memory bandwidth supported by processor (max)Differs	25.6 GB/s	32 GB/s
Memory1 differ
Memory clock speeds supported by processorDiffers	800,1066 MHz	800,1066,1333 MHz
ECCKnown for one	Yes	Unknown — not stated by the source
Operational conditionsidentical
Maximum operating temperatureKnown for one	Unknown — not stated by the source	78.5 °C
Weight & dimensionsidentical
WidthKnown for one	Unknown — not stated by the source	45 mm
HeightKnown for one	Unknown — not stated by the source	42.5 mm
Other featuresidentical
Temperature (max)Known for one	77.6 °C	Unknown — not stated by the source

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.