Product comparison · 2 cpus

HP E5630 SL170 G6 FIO Kit vs HP X5675 processor

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  • 22specifications compared
  • 10differ
  • 12identical
  • 5known for one product only

Key differences

The HP X5675 processor has 0.53 GHz more processor base frequency than the HP E5630 SL170 G6 FIO Kit (3.06 GHz vs 2.53 GHz). The HP X5675 processor has 2 more processor cores than the HP E5630 SL170 G6 FIO Kit (6 vs 4). The HP X5675 processor has 4 more processor threads than the HP E5630 SL170 G6 FIO Kit (12 vs 8). Processor model: E5630 on the HP E5630 SL170 G6 FIO Kit, X5675 on the HP X5675 processor. Memory clock speeds supported by processor: 800,1066 MHz on the HP E5630 SL170 G6 FIO Kit, 800,1066,1333 MHz on the HP X5675 processor.

  • Processor model
    • E5630 SL170 G6 FIO Kit:E5630
    • X5675 processor:X5675
  • Processor base frequency
    • E5630 SL170 G6 FIO Kit:2.53 GHz
    • X5675 processor:3.06 GHz
  • Processor cores
    • E5630 SL170 G6 FIO Kit:4
    • X5675 processor:6
  • Processor threads
    • E5630 SL170 G6 FIO Kit:8
    • X5675 processor:12
  • System bus rate
    • E5630 SL170 G6 FIO Kit:5.86 GT/s
    • X5675 processor:6.4 GT/s
  • Processor boost frequency
    • E5630 SL170 G6 FIO Kit:2.8 GHz
    • X5675 processor:3.46 GHz
  • Thermal Design Power (TDP)
    • E5630 SL170 G6 FIO Kit:80 W
    • X5675 processor:95 W
  • CPU multiplier (bus/core ratio)
    • E5630 SL170 G6 FIO Kit:19
    • X5675 processor:23

Side by side

Differences highlightedShow differences only (off)
Comparison of E5630 SL170 G6 FIO Kit, X5675
27 specifications
Processor9 differ
Processor familyIntel® Xeon® 5000 SequenceIntel® Xeon® 5000 Sequence
Processor modelDiffersE5630X5675
Processor base frequencyDiffers2.53 GHz3.06 GHz
Processor coresDiffers46
Processor socketSocket B (LGA 1366)Socket B (LGA 1366)
Processor lithography32 nm32 nm
Package typeTrayTray
Component forServer/workstationServer/workstation
Processor threadsDiffers812
System bus rateDiffers5.86 GT/s6.4 GT/s
Processor operating modes64-bit64-bit
Processor boost frequencyDiffers2.8 GHz3.46 GHz
Processor cache12 MB12 MB
Processor cache typeL3L3
Thermal Design Power (TDP)Differs80 W95 W
VID Voltage Range0.750 - 1.350 V0.750 - 1.350 V
CPU multiplier (bus/core ratio)Differs1923
Memory bandwidth supported by processor (max)Differs25.6 GB/s32 GB/s
Memory1 differ
Maximum internal memory supported by processor288 GB288 GB
Memory clock speeds supported by processorDiffers800,1066 MHz800,1066,1333 MHz
Memory channelsTriple-channelTriple-channel
ECCKnown for oneYesUnknown — not stated by the source
Featuresidentical
Market segmentServerServer
Operational conditionsidentical
Maximum operating temperatureKnown for oneUnknown — not stated by the source81.3 °C
Weight & dimensionsidentical
WidthKnown for oneUnknown — not stated by the source45 mm
HeightKnown for oneUnknown — not stated by the source42.5 mm
Other featuresidentical
Temperature (max)Known for one77.6 °CUnknown — not stated by the source

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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