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Product comparison · 2 cpus

HP E5606 ML/DL370 G6 FIO Kit vs HP SL160S G6 E5649 FIO Kit

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  • 22specifications compared
  • 9differ
  • 13identical
  • 2known for one product only

Key differences

The HP SL160S G6 E5649 FIO Kit has 0.4 GHz more processor base frequency than the HP E5606 ML/DL370 G6 FIO Kit (2.53 GHz vs 2.13 GHz). The HP SL160S G6 E5649 FIO Kit has 2 more processor cores than the HP E5606 ML/DL370 G6 FIO Kit (6 vs 4). The HP SL160S G6 E5649 FIO Kit has 8 more processor threads than the HP E5606 ML/DL370 G6 FIO Kit (12 vs 4). Processor model: E5606 on the HP E5606 ML/DL370 G6 FIO Kit, E5649 on the HP SL160S G6 E5649 FIO Kit. Memory clock speeds supported by processor: 800,1066 MHz on the HP E5606 ML/DL370 G6 FIO Kit, 800,1066,1333 MHz on the HP SL160S G6 E5649 FIO Kit.

  • Processor model
    • E5606
    • E5649
  • Processor base frequency
    • 2.13 GHz
    • 2.53 GHz
  • Processor cores
    • 4
    • 6
  • Processor threads
    • 4
    • 12
  • System bus rate
    • 4.8 GT/s
    • 5.86 GT/s
  • Processor cache
    • 8 MB
    • 12 MB
  • CPU multiplier (bus/core ratio)
    • 16
    • 19
  • Memory bandwidth supported by processor (max)
    • 25.6 GB/s
    • 32 GB/s

Side by side

Differences highlightedShow differences only
24 specifications
A

HP

E5606 ML/DL370 G6 FIO KitView product
B

HP

SL160S G6 E5649 FIO KitView product
Processor8 differ
Processor modelDiffersE5606E5649
Processor base frequencyDiffers2.13 GHz2.53 GHz
Processor coresDiffers46
Processor threadsDiffers412
System bus rateDiffers4.8 GT/s5.86 GT/s
Processor boost frequencyKnown for one2.93 GHz
Processor cacheDiffers8 MB12 MB
CPU multiplier (bus/core ratio)Differs1619
Memory bandwidth supported by processor (max)Differs25.6 GB/s32 GB/s
Memory1 differ
Memory clock speeds supported by processorDiffers800,1066 MHz800,1066,1333 MHz
Other featuresidentical
Temperature (max)Known for one76.2 °C

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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