Product comparison · 2 cpus

HP E5-2609 v4 1.7 1866 8C 1st vs HP Z640 Xeon E5-2603 v4 1.7 6C 2nd

Add a product
  • 54specifications compared
  • 6differ
  • 48identical
  • 1known for one product only

Key differences

  • Processor model
    • E5-2609 v4 1.7 1866 8C 1st:E5-2609V4
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:E5-2603V4
  • Processor cores
    • E5-2609 v4 1.7 1866 8C 1st:8
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:6
  • Processor threads
    • E5-2609 v4 1.7 1866 8C 1st:8
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:6
  • Processor cache
    • E5-2609 v4 1.7 1866 8C 1st:20 MB
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:15 MB
  • Embedded options available
    • E5-2609 v4 1.7 1866 8C 1st:Yes
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:No
  • Tcase
    • E5-2609 v4 1.7 1866 8C 1st:74 °C
    • Z640 Xeon E5-2603 v4 1.7 6C 2nd:73 °C

Side by side

Differences highlightedShow differences only (off)
Comparison of E5-2609 v4 1.7 1866 8C 1st, Z640 Xeon E5-2603 v4 1.7 6C 2nd
55 specifications
Processor4 differ
Processor familyIntel® Xeon® E5 v4Intel® Xeon® E5 v4
Processor modelDiffersE5-2609V4E5-2603V4
Processor base frequency1.7 GHz1.7 GHz
Processor coresDiffers86
Processor socketLGA 2011 (Socket R)LGA 2011 (Socket R)
Processor lithography14 nm14 nm
Package typeTrayTray
Component forServer/workstationServer/workstation
Processor seriesIntel Xeon E5-2600 v4Intel Xeon E5-2600 v4
Processor threadsDiffers86
System bus rate6.4 GT/s6.4 GT/s
Processor operating modes64-bit64-bit
Processor cacheDiffers20 MB15 MB
Processor cache typeSmart CacheSmart Cache
Thermal Design Power (TDP)85 W85 W
SteppingR0R0
Bus typeQPIQPI
Number of QPI links22
Memory bandwidth supported by processor (max)59.7 GB/s59.7 GB/s
Memoryidentical
Maximum internal memory supported by processor1.53 TB1.53 TB
Memory types supported by processorDDR4-SDRAMDDR4-SDRAM
Memory clock speeds supported by processor1600,1866 MHz1600,1866 MHz
Memory channelsQuad-channelQuad-channel
ECCYesYes
Graphicsidentical
On-board graphics cardNoNo
Features1 differ
Execute Disable BitYesYes
Idle StatesYesYes
Thermal Monitoring TechnologiesYesYes
Market segmentServerServer
Maximum number of PCI Express lanes4040
PCI Express slots version3.03.0
Supported instruction setsAVX 2.0AVX 2.0
CPU configuration (max)22
Embedded options availableDiffersYesNo
Physical Address Extension (PAE)YesYes
Scalability2S2S
Processor special featuresidentical
Enhanced Intel SpeedStep TechnologyYesYes
Intel Flex Memory AccessNoNo
Intel Trusted Execution TechnologyYesYes
Intel® AES New Instructions (Intel® AES-NI)YesYes
Intel® Hyper Threading Technology (Intel® HT Technology)NoNo
Intel® Identity Protection Technology (Intel® IPT)NoNo
Intel® Turbo Boost Technology2.02.0
Conflict-Free processorYesYes
Intel 64YesYes
Intel Demand Based SwitchingYesYes
Intel TSX-NIYesYes
Intel VT-x with Extended Page Tables (EPT)YesYes
Intel Virtualization Technology (VT-x)YesYes
Intel Virtualization Technology for Directed I/O (VT-d)YesYes
Intel® OS GuardYesYes
Intel® Secure KeyYesYes
Intel® vPro™ Platform EligibilityYesYes
Operational conditions1 differ
TcaseDiffers74 °C73 °C
Other featuresidentical
CompatibilityKnown for oneXL1x0r Gen9Unknown — not stated by the source

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

More cpu comparisons

All cpu comparisons