Product comparison · 2 cpus

HP DL380G5 X5460 HPM FIO Perf Pack vs NEC Intel Xeon E5530

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  • 25specifications compared
  • 15differ
  • 10identical
  • 22known for one product only

Key differences

  • Processor model
    • DL380G5 X5460 HPM FIO Perf Pack:X5460
    • Intel Xeon E5530:E5530
  • Processor base frequency
    • DL380G5 X5460 HPM FIO Perf Pack:3.16 GHz
    • Intel Xeon E5530:2.4 GHz
  • Processor socket
    • DL380G5 X5460 HPM FIO Perf Pack:LGA 771 (Socket J)
    • Intel Xeon E5530:Socket B (LGA 1366)
  • Processor threads
    • DL380G5 X5460 HPM FIO Perf Pack:4
    • Intel Xeon E5530:8
  • Processor operating modes
    • DL380G5 X5460 HPM FIO Perf Pack:32-bit, 64-bit
    • Intel Xeon E5530:64-bit
  • Processor cache
    • DL380G5 X5460 HPM FIO Perf Pack:12 MB
    • Intel Xeon E5530:8 MB
  • Processor cache type
    • DL380G5 X5460 HPM FIO Perf Pack:L2
    • Intel Xeon E5530:L3
  • Thermal Design Power (TDP)
    • DL380G5 X5460 HPM FIO Perf Pack:120 W
    • Intel Xeon E5530:80 W

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Comparison of DL380G5 X5460 HPM FIO Perf Pack, Intel Xeon E5530
47 specifications
Processor10 differ
Processor modelDiffersX5460E5530
Processor base frequencyDiffers3.16 GHz2.4 GHz
Processor socketDiffersLGA 771 (Socket J)Socket B (LGA 1366)
Processor threadsDiffers48
System bus rateKnown for oneUnknown — not stated by the source5.86 GT/s
Processor operating modesDiffers32-bit, 64-bit64-bit
Processor boost frequencyKnown for oneUnknown — not stated by the source2.66 GHz
Processor cacheDiffers12 MB8 MB
Processor cache typeDiffersL2L3
Thermal Design Power (TDP)Differs120 W80 W
VID Voltage RangeDiffers0.850 - 1.350 V0.75 - 1.35 V
SteppingDiffersC0D0
Bus typeKnown for oneUnknown — not stated by the sourceQPI
CPU multiplier (bus/core ratio)Known for oneUnknown — not stated by the source18
Number of QPI linksKnown for oneUnknown — not stated by the source2
Memory bandwidth supported by processor (max)Known for oneUnknown — not stated by the source25.6 GB/s
Processor front side busKnown for one1333 MHzUnknown — not stated by the source
FSB ParityKnown for oneYesUnknown — not stated by the source
Memoryidentical
Maximum internal memory supported by processorKnown for oneUnknown — not stated by the source144 GB
Memory types supported by processorKnown for oneUnknown — not stated by the sourceDDR3-SDRAM
Memory clock speeds supported by processorKnown for oneUnknown — not stated by the source800,1066 MHz
Memory channelsKnown for oneUnknown — not stated by the sourceTriple-channel
ECCKnown for oneUnknown — not stated by the sourceYes
Graphics1 differ
On-board graphics cardDiffersNoYes
Featuresidentical
Processing Die sizeKnown for oneUnknown — not stated by the source263 mm²
Embedded options availableKnown for oneUnknown — not stated by the sourceNo
Thermal Monitoring TechnologiesKnown for oneYesUnknown — not stated by the source
Number of Graphics & IMC Die TransistorsKnown for one820 MUnknown — not stated by the source
Graphics & IMC Die SizeKnown for one214 mm²Unknown — not stated by the source
Processor special features2 differ
Intel Trusted Execution TechnologyKnown for oneUnknown — not stated by the sourceNo
Intel® Hyper Threading Technology (Intel® HT Technology)DiffersNoYes
Intel® Turbo Boost TechnologyDiffersNoYes
Intel VT-x with Extended Page Tables (EPT)Known for oneUnknown — not stated by the sourceYes
Intel Virtualization Technology for Directed I/O (VT-d)Known for oneUnknown — not stated by the sourceYes
Operational conditions1 differ
TcaseDiffers63 °C76 °C
Weight & dimensionsidentical
Package dimensions (WxDxH)Known for oneUnknown — not stated by the source42.5 x 42.5 x 45 mm
Other features1 differ
Intel® Virtualization Technology (Intel® VT)DiffersVT-xVT-d, VT-x

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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