Product comparison · 2 cpus

HP DL380G5 X5460 HPM FIO Perf Pack vs HP Intel Xeon E5450, HPM FIO

25specifications compared
5differ
20identical
7known for one product only

Key differences

Processor model
- DL380G5 X5460 HPM FIO Perf Pack:X5460
- Intel Xeon E5450, HPM FIO:E5450
Processor base frequency
- DL380G5 X5460 HPM FIO Perf Pack:3.16 GHz
- Intel Xeon E5450, HPM FIO:3 GHz
Thermal Design Power (TDP)
- DL380G5 X5460 HPM FIO Perf Pack:120 W
- Intel Xeon E5450, HPM FIO:80 W
VID Voltage Range
- DL380G5 X5460 HPM FIO Perf Pack:0.850 - 1.350 V
- Intel Xeon E5450, HPM FIO:0.85 - 1.35 V
Tcase
- DL380G5 X5460 HPM FIO Perf Pack:63 °C
- Intel Xeon E5450, HPM FIO:67 °C

Side by side

Differences highlightedShow differences only

Comparison of DL380G5 X5460 HPM FIO Perf Pack, Intel Xeon E5450, HPM FIO
32 specifications	A HP DL380G5 X5460 HPM FIO Perf Pack View product	B HP Intel Xeon E5450, HPM FIO View product
Processor4 differ
Processor family	Intel® Xeon® 5000 Sequence	Intel® Xeon® 5000 Sequence
Processor modelDiffers	X5460	E5450
Processor base frequencyDiffers	3.16 GHz	3 GHz
Processor cores	4	4
Processor socket	LGA 771 (Socket J)	LGA 771 (Socket J)
Processor lithography	45 nm	45 nm
Component for	Server/workstation	Server/workstation
Processor threads	4	4
Processor operating modes	32-bit, 64-bit	32-bit, 64-bit
Processor cache	12 MB	12 MB
Processor cache type	L2	L2
Processor front side bus	1333 MHz	1333 MHz
Thermal Design Power (TDP)Differs	120 W	80 W
VID Voltage RangeDiffers	0.850 - 1.350 V	0.85 - 1.35 V
FSB Parity	Yes	Yes
SteppingKnown for one	C0	Unknown — not stated by the source
Graphicsidentical
On-board graphics card	No	No
Featuresidentical
Execute Disable Bit	Yes	Yes
Idle States	Yes	Yes
Thermal Monitoring Technologies	Yes	Yes
Market segment	Server	Server
Number of Graphics & IMC Die TransistorsKnown for one	820 M	Unknown — not stated by the source
Graphics & IMC Die SizeKnown for one	214 mm²	Unknown — not stated by the source
Number of Processing Die TransistorsKnown for one	Unknown — not stated by the source	820 M
Processing Die sizeKnown for one	Unknown — not stated by the source	214 mm²
Processor special featuresidentical
Enhanced Intel SpeedStep Technology	Yes	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)Known for one	No	Unknown — not stated by the source
Intel® Turbo Boost TechnologyKnown for one	No	Unknown — not stated by the source
Intel Demand Based Switching	Yes	Yes
Intel Virtualization Technology (VT-x)	Yes	Yes
Operational conditions1 differ
TcaseDiffers	63 °C	67 °C
Other featuresidentical
Intel® Virtualization Technology (Intel® VT)	VT-x	VT-x

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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