Product comparison · 2 cpus

HP DL160 G6 X5690 FIO Kit vs HP SL160S G6 E5649 FIO Kit

24specifications compared
7differ
17identical
0known for one product only

Key differences

The HP DL160 G6 X5690 FIO Kit has 0.93 GHz more processor base frequency than the HP SL160S G6 E5649 FIO Kit (3.46 GHz vs 2.53 GHz). The HP DL160 G6 X5690 FIO Kit has 0.54 GT/s more system bus rate than the HP SL160S G6 E5649 FIO Kit (6.4 GT/s vs 5.86 GT/s). The HP DL160 G6 X5690 FIO Kit has 0.8 GHz more processor boost frequency than the HP SL160S G6 E5649 FIO Kit (3.73 GHz vs 2.93 GHz). Processor model: X5690 on the HP DL160 G6 X5690 FIO Kit, E5649 on the HP SL160S G6 E5649 FIO Kit.

Processor model
- DL160 G6 X5690 FIO Kit:X5690
- SL160S G6 E5649 FIO Kit:E5649
Processor base frequency
- DL160 G6 X5690 FIO Kit:3.46 GHz
- SL160S G6 E5649 FIO Kit:2.53 GHz
System bus rate
- DL160 G6 X5690 FIO Kit:6.4 GT/s
- SL160S G6 E5649 FIO Kit:5.86 GT/s
Processor boost frequency
- DL160 G6 X5690 FIO Kit:3.73 GHz
- SL160S G6 E5649 FIO Kit:2.93 GHz
Thermal Design Power (TDP)
- DL160 G6 X5690 FIO Kit:130 W
- SL160S G6 E5649 FIO Kit:80 W
CPU multiplier (bus/core ratio)
- DL160 G6 X5690 FIO Kit:26
- SL160S G6 E5649 FIO Kit:19
Temperature (max)
- DL160 G6 X5690 FIO Kit:78.5 °C
- SL160S G6 E5649 FIO Kit:76.2 °C

Side by side

Differences highlightedShow differences only

Comparison of DL160 G6 X5690 FIO Kit, SL160S G6 E5649 FIO Kit
24 specifications	A HP DL160 G6 X5690 FIO Kit View product	B HP SL160S G6 E5649 FIO Kit View product
Processor6 differ
Processor family	Intel® Xeon® 5000 Sequence	Intel® Xeon® 5000 Sequence
Processor modelDiffers	X5690	E5649
Processor base frequencyDiffers	3.46 GHz	2.53 GHz
Processor cores	6	6
Processor socket	Socket B (LGA 1366)	Socket B (LGA 1366)
Processor lithography	32 nm	32 nm
Package type	Tray	Tray
Component for	Server/workstation	Server/workstation
Processor threads	12	12
System bus rateDiffers	6.4 GT/s	5.86 GT/s
Processor operating modes	64-bit	64-bit
Processor boost frequencyDiffers	3.73 GHz	2.93 GHz
Processor cache	12 MB	12 MB
Processor cache type	L3	L3
Thermal Design Power (TDP)Differs	130 W	80 W
VID Voltage Range	0.750 - 1.350 V	0.750 - 1.350 V
CPU multiplier (bus/core ratio)Differs	26	19
Memory bandwidth supported by processor (max)	32 GB/s	32 GB/s
Memoryidentical
Maximum internal memory supported by processor	288 GB	288 GB
Memory clock speeds supported by processor	800,1066,1333 MHz	800,1066,1333 MHz
Memory channels	Triple-channel	Triple-channel
ECC	Yes	Yes
Featuresidentical
Market segment	Server	Server
Other features1 differ
Temperature (max)Differs	78.5 °C	76.2 °C

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

More cpu comparisons

All cpu comparisons