Product comparison · 2 cpus

HP BL460c G7 E5630 FIO Kit vs HP X5650 BL2x220c G6 2P FIO Kit

Key differences

Processor model
- BL460c G7 E5630 FIO Kit:E5630
- X5650 BL2x220c G6 2P FIO Kit:X5650
Processor base frequency
- BL460c G7 E5630 FIO Kit:2.53 GHz
- X5650 BL2x220c G6 2P FIO Kit:2.66 GHz
Processor cores
- BL460c G7 E5630 FIO Kit:4
- X5650 BL2x220c G6 2P FIO Kit:6
Processor threads
- BL460c G7 E5630 FIO Kit:8
- X5650 BL2x220c G6 2P FIO Kit:12
System bus rate
- BL460c G7 E5630 FIO Kit:5.86 GT/s
- X5650 BL2x220c G6 2P FIO Kit:6.4 GT/s
Processor boost frequency
- BL460c G7 E5630 FIO Kit:2.8 GHz
- X5650 BL2x220c G6 2P FIO Kit:3.06 GHz
Thermal Design Power (TDP)
- BL460c G7 E5630 FIO Kit:80 W
- X5650 BL2x220c G6 2P FIO Kit:95 W
CPU multiplier (bus/core ratio)
- BL460c G7 E5630 FIO Kit:19
- X5650 BL2x220c G6 2P FIO Kit:20

Differences highlightedShow differences only

Comparison of BL460c G7 E5630 FIO Kit, X5650 BL2x220c G6 2P FIO Kit
24 specifications	A HP BL460c G7 E5630 FIO Kit View product	B HP X5650 BL2x220c G6 2P FIO Kit View product
Processor9 differ
Processor modelDiffers	E5630	X5650
Processor base frequencyDiffers	2.53 GHz	2.66 GHz
Processor coresDiffers	4	6
Processor threadsDiffers	8	12
System bus rateDiffers	5.86 GT/s	6.4 GT/s
Processor boost frequencyDiffers	2.8 GHz	3.06 GHz
Thermal Design Power (TDP)Differs	80 W	95 W
CPU multiplier (bus/core ratio)Differs	19	20
Memory bandwidth supported by processor (max)Differs	25.6 GB/s	32 GB/s
Memory1 differ
Memory clock speeds supported by processorDiffers	800,1066 MHz	800,1066,1333 MHz
Other features1 differ
Temperature (max)Differs	77.6 °C	81.3 °C

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.