Product comparison · 2 cpus

HP BL2X220C G7 X5675 FIO KIT vs HP BL490c G7 E5649 FIO Kit

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  • 24specifications compared
  • 7differ
  • 17identical
  • 0known for one product only

Key differences

The HP BL2X220C G7 X5675 FIO KIT has 0.53 GHz more processor base frequency than the HP BL490c G7 E5649 FIO Kit (3.06 GHz vs 2.53 GHz). The HP BL2X220C G7 X5675 FIO KIT has 0.54 GT/s more system bus rate than the HP BL490c G7 E5649 FIO Kit (6.4 GT/s vs 5.86 GT/s). The HP BL2X220C G7 X5675 FIO KIT has 0.53 GHz more processor boost frequency than the HP BL490c G7 E5649 FIO Kit (3.46 GHz vs 2.93 GHz). Processor model: X5675 on the HP BL2X220C G7 X5675 FIO KIT, E5649 on the HP BL490c G7 E5649 FIO Kit.

  • Processor model
    • BL2X220C G7 X5675 FIO KIT:X5675
    • BL490c G7 E5649 FIO Kit:E5649
  • Processor base frequency
    • BL2X220C G7 X5675 FIO KIT:3.06 GHz
    • BL490c G7 E5649 FIO Kit:2.53 GHz
  • System bus rate
    • BL2X220C G7 X5675 FIO KIT:6.4 GT/s
    • BL490c G7 E5649 FIO Kit:5.86 GT/s
  • Processor boost frequency
    • BL2X220C G7 X5675 FIO KIT:3.46 GHz
    • BL490c G7 E5649 FIO Kit:2.93 GHz
  • Thermal Design Power (TDP)
    • BL2X220C G7 X5675 FIO KIT:95 W
    • BL490c G7 E5649 FIO Kit:80 W
  • CPU multiplier (bus/core ratio)
    • BL2X220C G7 X5675 FIO KIT:23
    • BL490c G7 E5649 FIO Kit:19
  • Temperature (max)
    • BL2X220C G7 X5675 FIO KIT:81.3 °C
    • BL490c G7 E5649 FIO Kit:76.2 °C

Side by side

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Comparison of BL2X220C G7 X5675 FIO KIT, BL490c G7 E5649 FIO Kit
24 specifications
Processor6 differ
Processor familyIntel® Xeon® 5000 SequenceIntel® Xeon® 5000 Sequence
Processor modelDiffersX5675E5649
Processor base frequencyDiffers3.06 GHz2.53 GHz
Processor cores66
Processor socketSocket B (LGA 1366)Socket B (LGA 1366)
Processor lithography32 nm32 nm
Package typeTrayTray
Component forServer/workstationServer/workstation
Processor threads1212
System bus rateDiffers6.4 GT/s5.86 GT/s
Processor operating modes64-bit64-bit
Processor boost frequencyDiffers3.46 GHz2.93 GHz
Processor cache12 MB12 MB
Processor cache typeL3L3
Thermal Design Power (TDP)Differs95 W80 W
VID Voltage Range0.750 - 1.350 V0.750 - 1.350 V
CPU multiplier (bus/core ratio)Differs2319
Memory bandwidth supported by processor (max)32 GB/s32 GB/s
Memoryidentical
Maximum internal memory supported by processor288 GB288 GB
Memory clock speeds supported by processor800,1066,1333 MHz800,1066,1333 MHz
Memory channelsTriple-channelTriple-channel
ECCYesYes
Featuresidentical
Market segmentServerServer
Other features1 differ
Temperature (max)Differs81.3 °C76.2 °C

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