Product comparison · 2 cpus

Fujitsu Intel Xeon X5647 2.93GHz 12MB TB vs HP Intel Xeon X5450

26specifications compared
13differ
13identical
22known for one product only

Key differences

Processor model
- Intel Xeon X5647 2.93GHz 12MB TB:X5647
- Intel Xeon X5450:X5450
Processor base frequency
- Intel Xeon X5647 2.93GHz 12MB TB:2.93 GHz
- Intel Xeon X5450:3 GHz
Processor socket
- Intel Xeon X5647 2.93GHz 12MB TB:Socket B (LGA 1366)
- Intel Xeon X5450:LGA 771 (Socket J)
Processor lithography
- Intel Xeon X5647 2.93GHz 12MB TB:32 nm
- Intel Xeon X5450:45 nm
Processor cache type
- Intel Xeon X5647 2.93GHz 12MB TB:L3
- Intel Xeon X5450:L2
Thermal Design Power (TDP)
- Intel Xeon X5647 2.93GHz 12MB TB:130 W
- Intel Xeon X5450:120 W
VID Voltage Range
- Intel Xeon X5647 2.93GHz 12MB TB:0.750 - 1.350 V
- Intel Xeon X5450:0.850 - 1.350 V
Intel Trusted Execution Technology
- Intel Xeon X5647 2.93GHz 12MB TB:Yes
- Intel Xeon X5450:No

Side by side

Differences highlightedShow differences only

Comparison of Intel Xeon X5647 2.93GHz 12MB TB, Intel Xeon X5450
48 specifications	A Fujitsu Intel Xeon X5647 2.93GHz 12MB TB View product	B HP Intel Xeon X5450 View product
Processor7 differ
Processor modelDiffers	X5647	X5450
Processor base frequencyDiffers	2.93 GHz	3 GHz
Processor socketDiffers	Socket B (LGA 1366)	LGA 771 (Socket J)
Processor lithographyDiffers	32 nm	45 nm
Processor threadsKnown for one	8	Unknown — not stated by the source
System bus rateKnown for one	5.86 GT/s	Unknown — not stated by the source
Processor boost frequencyKnown for one	3.2 GHz	Unknown — not stated by the source
Processor cache typeDiffers	L3	L2
Thermal Design Power (TDP)Differs	130 W	120 W
VID Voltage RangeDiffers	0.750 - 1.350 V	0.850 - 1.350 V
Bus typeKnown for one	QPI	Unknown — not stated by the source
CPU multiplier (bus/core ratio)Known for one	22	Unknown — not stated by the source
Number of QPI linksKnown for one	2	Unknown — not stated by the source
Memory bandwidth supported by processor (max)Known for one	25.6 GB/s	Unknown — not stated by the source
Processor front side busKnown for one	Unknown — not stated by the source	1333 MHz
FSB ParityKnown for one	Unknown — not stated by the source	Yes
Memoryidentical
Maximum internal memory supported by processorKnown for one	288 GB	Unknown — not stated by the source
Memory types supported by processorKnown for one	DDR3-SDRAM	Unknown — not stated by the source
Memory clock speeds supported by processorKnown for one	800,1066 MHz	Unknown — not stated by the source
Memory channelsKnown for one	Triple-channel	Unknown — not stated by the source
ECCKnown for one	Yes	Unknown — not stated by the source
Featuresidentical
CPU configuration (max)Known for one	2	Unknown — not stated by the source
Number of Processing Die TransistorsKnown for one	Unknown — not stated by the source	820 M
Processing Die sizeKnown for one	Unknown — not stated by the source	214 mm²
Embedded options availableKnown for one	Unknown — not stated by the source	No
Processor special features4 differ
Intel Trusted Execution TechnologyDiffers	Yes	No
Intel® AES New Instructions (Intel® AES-NI)Known for one	Yes	Unknown — not stated by the source
Intel® Hyper Threading Technology (Intel® HT Technology)Differs	Yes	No
Intel® Turbo Boost TechnologyDiffers	Yes	No
Intel VT-x with Extended Page Tables (EPT)Differs	Yes	No
Intel Virtualization Technology for Directed I/O (VT-d)Known for one	Yes	Unknown — not stated by the source
Operational conditions1 differ
TcaseDiffers	80.4 °C	63 °C
Other features1 differ
Intel® Virtualization Technology (Intel® VT)Differs	VT-d, VT-x	VT-x
CompatibilityKnown for one	CELSIUS R570-2	Unknown — not stated by the source
Weight & dimensionsidentical
Processor package sizeKnown for one	Unknown — not stated by the source	37.5 mm

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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