Product comparison · 2 cpus

Acer Intel Core2 Duo T5870 vs HP Intel Xeon E5-2670

15specifications compared
12differ
3identical
40known for one product only

Key differences

The HP Intel Xeon E5-2670 has 0.6 GHz more processor base frequency than the Acer Intel Core2 Duo T5870 (2.6 GHz vs 2 GHz). The HP Intel Xeon E5-2670 has 6 more processor cores than the Acer Intel Core2 Duo T5870 (8 vs 2). The Acer Intel Core2 Duo T5870 has 33 nm more processor lithography than the HP Intel Xeon E5-2670 (65 nm vs 32 nm). Processor family: Intel® Core™2 Duo on the Acer Intel Core2 Duo T5870, Intel® Xeon® E5 Family on the HP Intel Xeon E5-2670. Processor model: T5870 on the Acer Intel Core2 Duo T5870, E5-2670 on the HP Intel Xeon E5-2670.

Processor family
- Intel Core2 Duo T5870:Intel® Core™2 Duo
- Intel Xeon E5-2670:Intel® Xeon® E5 Family
Processor model
- Intel Core2 Duo T5870:T5870
- Intel Xeon E5-2670:E5-2670
Processor base frequency
- Intel Core2 Duo T5870:2 GHz
- Intel Xeon E5-2670:2.6 GHz
Processor cores
- Intel Core2 Duo T5870:2
- Intel Xeon E5-2670:8
Processor lithography
- Intel Core2 Duo T5870:65 nm
- Intel Xeon E5-2670:32 nm
Package type
- Intel Core2 Duo T5870:Tray
- Intel Xeon E5-2670:Box
Component for
- Intel Core2 Duo T5870:Laptop
- Intel Xeon E5-2670:Server/workstation
Thermal Design Power (TDP)
- Intel Core2 Duo T5870:35 W
- Intel Xeon E5-2670:115 W

Side by side

Differences highlightedShow differences only

Comparison of Intel Core2 Duo T5870, Intel Xeon E5-2670
55 specifications	A Acer Intel Core2 Duo T5870 View product	B HP Intel Xeon E5-2670 View product
Processor9 differ
Processor familyDiffers	Intel® Core™2 Duo	Intel® Xeon® E5 Family
Processor modelDiffers	T5870	E5-2670
Processor base frequencyDiffers	2 GHz	2.6 GHz
Processor coresDiffers	2	8
Processor socketKnown for one	Unknown — not stated by the source	LGA 2011 (Socket R)
Processor lithographyDiffers	65 nm	32 nm
Package typeDiffers	Tray	Box
Component forDiffers	Laptop	Server/workstation
Processor threadsKnown for one	Unknown — not stated by the source	16
System bus rateKnown for one	Unknown — not stated by the source	8 GT/s
Processor boost frequencyKnown for one	Unknown — not stated by the source	3.3 GHz
Processor cacheKnown for one	Unknown — not stated by the source	20 MB
Processor cache typeKnown for one	Unknown — not stated by the source	L3
Thermal Design Power (TDP)Differs	35 W	115 W
VID Voltage RangeDiffers	1.075 - 1.175 V	0.6 - 1.35 V
SteppingKnown for one	Unknown — not stated by the source	C2
Bus typeKnown for one	Unknown — not stated by the source	QPI
CPU multiplier (bus/core ratio)Known for one	Unknown — not stated by the source	33
Number of QPI linksKnown for one	Unknown — not stated by the source	2
Memory bandwidth supported by processor (max)Known for one	Unknown — not stated by the source	51.2 GB/s
L2 cache speedKnown for one	2 GHz	Unknown — not stated by the source
Processor front side busKnown for one	800 MHz	Unknown — not stated by the source
Memoryidentical
Maximum internal memory supported by processorKnown for one	Unknown — not stated by the source	750 GB
Memory types supported by processorKnown for one	Unknown — not stated by the source	DDR3-SDRAM
Memory clock speeds supported by processorKnown for one	Unknown — not stated by the source	800,1066,1333,1600 MHz
Memory channelsKnown for one	Unknown — not stated by the source	Quad-channel
ECCKnown for one	Unknown — not stated by the source	Yes
Graphicsidentical
On-board graphics cardKnown for one	Unknown — not stated by the source	No
Features2 differ
Idle StatesKnown for one	Unknown — not stated by the source	Yes
Thermal Monitoring TechnologiesKnown for one	Unknown — not stated by the source	Yes
Market segmentDiffers	Mobile	Server
PCI Express slots versionKnown for one	Unknown — not stated by the source	3.0
Supported instruction setsKnown for one	Unknown — not stated by the source	AVX
CPU configuration (max)Known for one	Unknown — not stated by the source	2
Embedded options availableKnown for one	Unknown — not stated by the source	No
Graphics & IMC lithographyDiffers	65 nm	32 nm
Number of Processing Die TransistorsKnown for one	291 M	Unknown — not stated by the source
Processing Die sizeKnown for one	143 mm²	Unknown — not stated by the source
Processor special featuresidentical
Intel Flex Memory AccessKnown for one	Unknown — not stated by the source	Yes
Intel Trusted Execution TechnologyKnown for one	Unknown — not stated by the source	Yes
Intel® AES New Instructions (Intel® AES-NI)Known for one	Unknown — not stated by the source	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)Known for one	Unknown — not stated by the source	Yes
Intel® Turbo Boost TechnologyKnown for one	Unknown — not stated by the source	Yes
Intel Demand Based SwitchingKnown for one	Unknown — not stated by the source	Yes
Intel VT-x with Extended Page Tables (EPT)Known for one	Unknown — not stated by the source	Yes
Intel Virtualization Technology (VT-x)Known for one	Unknown — not stated by the source	Yes
Intel Virtualization Technology for Directed I/O (VT-d)Known for one	Unknown — not stated by the source	Yes
Intel® vPro™ Platform EligibilityKnown for one	Unknown — not stated by the source	Yes
Operational conditionsidentical
TcaseKnown for one	Unknown — not stated by the source	81.8 °C
TjunctionKnown for one	100 °C	Unknown — not stated by the source
Weight & dimensions1 differ
Processor package sizeDiffers	35 mm	52.5 mm
Other featuresidentical
Intel® Virtualization Technology (Intel® VT)Known for one	Unknown — not stated by the source	VT-d, VT-x

A dash means the value is not stated by the source. Unknown values are never counted for or against a product, and there is no overall score.

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